|
EU RoHS
|
Compliant |
|
ECCN (US)
|
EAR99 |
|
Part Status
|
Active |
|
HTS
|
8542.39.00.01 |
|
Automotive
|
No |
|
PPAP
|
No |
|
Logic Family
|
ABT |
|
Number of Elements per pcs
|
1 |
|
Number of Inputs per Chip
|
48 |
|
Number of Outputs per Chip
|
48 |
|
Maximum Frequency (GHz)
|
0.15(Min)@4.5V to 5.5V |
|
Absolute Propagation Delay Time (ns)
|
7.5 |
|
Maximum Propagation Delay Time @ Maximum CL (ns)
|
7.5@4.5V to 5.5V |
|
Process Technology
|
BiCMOS |
|
Output Type
|
3-State |
|
Polarity
|
Non-Inverting |
|
Maximum High Level Output Current (mA)
|
-32 |
|
Maximum Low Level Output Current (mA)
|
64 |
|
Operating Supply Voltage-Min (V)
|
4.5 |
|
Typical Operating Supply Voltage (V)
|
5 |
|
Operating Supply Voltage-Max (V)
|
5.5 |
|
Maximum Quiescent Current (uA)
|
40000 |
|
Propagation Delay Test Condition (pF)
|
50 |
|
Power Supply Type
|
Single |
|
Operating Temperature-Min
|
-40 |
|
Operating Temperature-Max
|
85 |
|
Supplier Temperature Grade
|
Commercial |
|
Packing Method
|
Tray |
|
Pin Count
|
80 |
|
Standard Package Method
|
QFP |
|
Original Package
|
LQFP |
|
Terminal Form
|
Surface Mount |
|
Package Height
|
1.45(Max) |
|
Package Length
|
12.2(Max) |
|
Package Width
|
12.2(Max) |
|
PCB changed
|
80 |