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    LM5111-1MY

    SKU: 129575
    Manufacturer: Texas Instruments
    Driver 5A 2-OUT Low Side Non-Inv 8-Pin HVSSOP EP T/R
    770 parts IN STOCK
    Shipped from :
    Netherlands
    Expected Ships :
    Rohs State : Need to verify

    QUANTITY

    Increments of 0 pcs
    Products specifications
    EU RoHS Not Compliant
    ECCN (US) EAR99
    Part Status Obsolete
    SVHC Yes
    SVHC Exceeds Threshold Yes
    Automotive No
    PPAP No
    Driver Type Low Side
    Driver Configuration Non-Inverting
    Number of Drivers 2
    Type MOSFET
    Number of Outputs 2
    Maximum Rise Time (ns) 25
    Maximum Fall Time (ns) 25
    Maximum Propagation Delay Time (ns) 40
    Input Logic Compatibility TTL
    Operating Supply Voltage-Min (V) 3.5
    Operating Supply Voltage-Max (V) 14
    Maximum Supply Current (mA) 2
    Peak Output Current (A) 5(Typ)
    Output Resistance (Ohm) 1.4
    Operating Temperature-Min -40
    Operating Temperature-Max 125
    Special Features Under Voltage Lockout
    Packing Method Tape and Reel
    Pin Count 8
    Standard Package Method SOP
    Original Package HVSSOP EP
    Terminal Form Surface Mount
    Package Height 0.95(Max)
    Package Length 3.1(Max)
    Package Width 3.1(Max)
    PCB changed 8
    Products specifications
    EU RoHS Not Compliant
    ECCN (US) EAR99
    Part Status Obsolete
    SVHC Yes
    SVHC Exceeds Threshold Yes
    Automotive No
    PPAP No
    Driver Type Low Side
    Driver Configuration Non-Inverting
    Number of Drivers 2
    Type MOSFET
    Number of Outputs 2
    Maximum Rise Time (ns) 25
    Maximum Fall Time (ns) 25
    Maximum Propagation Delay Time (ns) 40
    Input Logic Compatibility TTL
    Operating Supply Voltage-Min (V) 3.5
    Operating Supply Voltage-Max (V) 14
    Maximum Supply Current (mA) 2
    Peak Output Current (A) 5(Typ)
    Output Resistance (Ohm) 1.4
    Operating Temperature-Min -40
    Operating Temperature-Max 125
    Special Features Under Voltage Lockout
    Packing Method Tape and Reel
    Pin Count 8
    Standard Package Method SOP
    Original Package HVSSOP EP
    Terminal Form Surface Mount
    Package Height 0.95(Max)
    Package Length 3.1(Max)
    Package Width 3.1(Max)
    PCB changed 8