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    LM27222MX/NOPB

    SKU: 19349
    Manufacturer: Texas Instruments
    Driver 4.5A 2-OUT High and Low Side Inv/Non-Inv 8-Pin SOIC T/R
    1970 parts IN STOCK
    Shipped from :
    Netherlands
    Expected Ships :
    Rohs State : Need to verify

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    Increments of 0 pcs
    Products specifications
    EU RoHS Compliant
    ECCN (US) EAR99
    Part Status Active
    HTS 8542.39.00.01
    Automotive No
    PPAP No
    Driver Type High and Low Side
    Driver Configuration Inverting
    Number of Drivers 2
    High and Low Sides Dependency Synchronous
    Type MOSFET
    Number of Outputs 2
    Maximum Rise Time (ns) 17(Typ)
    Maximum Fall Time (ns) 14(Typ)
    Maximum Propagation Delay Time (ns) 8
    Operating Supply Voltage-Min (V) 4
    Operating Supply Voltage-Max (V) 6.85
    Maximum Supply Current (mA) 0.825
    Peak Output Current (A) 4.5(Typ)
    Maximum Power Dissipation (mW) 720
    Operating Temperature-Min -40
    Operating Temperature-Max 125
    Special Features Synchronous
    Packing Method Tape and Reel
    Pin Count 8
    Standard Package Method SOP
    Original Package SOIC
    Terminal Form Surface Mount
    Package Height 1.5(Max)
    Package Length 5(Max)
    Package Width 3.98(Max)
    PCB changed 8
    Products specifications
    EU RoHS Compliant
    ECCN (US) EAR99
    Part Status Active
    HTS 8542.39.00.01
    Automotive No
    PPAP No
    Driver Type High and Low Side
    Driver Configuration Inverting
    Number of Drivers 2
    High and Low Sides Dependency Synchronous
    Type MOSFET
    Number of Outputs 2
    Maximum Rise Time (ns) 17(Typ)
    Maximum Fall Time (ns) 14(Typ)
    Maximum Propagation Delay Time (ns) 8
    Operating Supply Voltage-Min (V) 4
    Operating Supply Voltage-Max (V) 6.85
    Maximum Supply Current (mA) 0.825
    Peak Output Current (A) 4.5(Typ)
    Maximum Power Dissipation (mW) 720
    Operating Temperature-Min -40
    Operating Temperature-Max 125
    Special Features Synchronous
    Packing Method Tape and Reel
    Pin Count 8
    Standard Package Method SOP
    Original Package SOIC
    Terminal Form Surface Mount
    Package Height 1.5(Max)
    Package Length 5(Max)
    Package Width 3.98(Max)
    PCB changed 8