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    LM1877MX-9/NOPB

    SKU: 132556
    Manufacturer: Texas Instruments
    Audio Amp Speaker 2-CH Stereo 1.3W Class-AB Automotive 14-Pin SOIC W T/R
    1320 parts IN STOCK
    Shipped from :
    Netherlands
    Expected Ships :
    Rohs State : Need to verify

    QUANTITY

    Increments of 0 pcs
    Products specifications
    EU RoHS Compliant
    ECCN (US) EAR99
    Part Status Active
    HTS 8542.33.00.01
    Automotive No
    PPAP No
    Function Speaker
    Amplifier Type Class-AB
    THDN 0.045%@8Ohm@1W
    Output Signal Type Single
    Output Type 2-Channel Stereo
    Output Voltage ±0.7(Max)
    Maximum Input Offset Voltage (mV) 15(Typ)
    Minimum Single Supply Voltage (V) 6
    Typical Single Supply Voltage (V) 9
    Maximum Single Supply Voltage (V) 24
    Maximum Input Bias Current (uA) 0.05(Typ)@20V
    Maximum Supply Current (mA) 50@20V
    Power Supply Type Single
    Typical Output Power x Channels @ Load (W) 1.3x2@8Ohm
    Operating Temperature-Min 0
    Operating Temperature-Max 70
    Packing Method Tape and Reel
    Pin Count 14
    Standard Package Method SOP
    Original Package SOIC W
    Terminal Form Surface Mount
    Package Height 2.34(Max)
    Package Length 9.2(Max)
    Package Width 7.6(Max)
    PCB changed 14
    Products specifications
    EU RoHS Compliant
    ECCN (US) EAR99
    Part Status Active
    HTS 8542.33.00.01
    Automotive No
    PPAP No
    Function Speaker
    Amplifier Type Class-AB
    THDN 0.045%@8Ohm@1W
    Output Signal Type Single
    Output Type 2-Channel Stereo
    Output Voltage ±0.7(Max)
    Maximum Input Offset Voltage (mV) 15(Typ)
    Minimum Single Supply Voltage (V) 6
    Typical Single Supply Voltage (V) 9
    Maximum Single Supply Voltage (V) 24
    Maximum Input Bias Current (uA) 0.05(Typ)@20V
    Maximum Supply Current (mA) 50@20V
    Power Supply Type Single
    Typical Output Power x Channels @ Load (W) 1.3x2@8Ohm
    Operating Temperature-Min 0
    Operating Temperature-Max 70
    Packing Method Tape and Reel
    Pin Count 14
    Standard Package Method SOP
    Original Package SOIC W
    Terminal Form Surface Mount
    Package Height 2.34(Max)
    Package Length 9.2(Max)
    Package Width 7.6(Max)
    PCB changed 14