EU RoHS
|
Compliant |
ECCN (US)
|
EAR99 |
Part Status
|
Active |
HTS
|
8542.39.00.01 |
Automotive
|
No |
PPAP
|
No |
Type
|
General Purpose |
Process Technology
|
CMOS |
Number of Channels per Chip
|
4 |
Maximum Data Rate
|
100Mbps |
Maximum Rise Time (ns)
|
3.9 |
Maximum Fall Time (ns)
|
3.9 |
Maximum Pulse Width Distortion (ns)
|
4.1 |
Output Type
|
Logic |
Operating Supply Voltage-Max (V)
|
5.5 |
Operating Supply Voltage-Min (V)
|
2.25 |
Maximum Propagation Delay Time (tPHL) (ns)
|
16 |
Minimum Isolation Voltage (Vrms)
|
5700 |
Maximum Propagation Delay Time (tPLH) (ns)
|
16 |
Maximum Working Insulation Voltage
|
1500Vrms |
Maximum Output Current Drive (mA)
|
15 |
Maximum Power Dissipation (mW)
|
200 |
Operating Temperature-Min
|
-55 |
Operating Temperature-Max
|
125 |
Packing Method
|
Tube |
Typical Operating Supply Voltage (V)
|
2.5 |
Forward/Reverse Channels
|
2/2 |
Minimum Common Mode Rejection (kV/us)
|
100 |
Maximum ESD Protection Voltage (kV)
|
1.5@CDM/6@HBM |
Supplier Temperature Grade
|
Industrial |
Coupling Type
|
Capacitive Coupling |
Standard Package Method
|
SOP |
Original Package
|
SOIC |
Pin Count
|
16 |
Terminal Form
|
Surface Mount |
Package Height
|
2.35(Max) |
Package Length
|
10.5(Max) |
Package Width
|
7.6(Max) |
PCB changed
|
16 |