EU RoHS
|
Not Compliant |
ECCN (US)
|
EAR99 |
Part Status
|
Active |
HTS
|
8542.31.00.01 |
SVHC
|
Yes |
SVHC Exceeds Threshold
|
Yes |
Automotive
|
No |
PPAP
|
No |
Type
|
High Speed Amplifier |
Manufacturer Type
|
High Speed Amplifier |
Number of Channels per Chip
|
1 |
Process Technology
|
BiCOM |
Maximum Input Offset Voltage (mV)
|
1.5@±5V |
Minimum Single Supply Voltage (V)
|
5.5 |
Typical Single Supply Voltage (V)
|
28 |
Maximum Single Supply Voltage (V)
|
36 |
Minimum Dual Supply Voltage (V)
|
±2.75 |
Typical Dual Supply Voltage (V)
|
±15 |
Maximum Dual Supply Voltage (V)
|
±18 |
Maximum Input Offset Current (uA)
|
4@±5V |
Maximum Input Bias Current (uA)
|
10@±5V |
Maximum Supply Current (mA)
|
8@±5V |
Typical Output Current (mA)
|
29@±5V |
Power Supply Type
|
Dual |
Maximum Power Dissipation (mW)
|
730 |
Typical Slew Rate (V/us)
|
2000(Min)@±15V |
Typical Input Noise Voltage Density (nV/rtHz)
|
14 |
Typical Voltage Gain (dB)
|
75(Min) |
Typical Noninverting Input Current Noise Density (pA/rtHz)
|
1.8 |
Minimum PSRR (dB)
|
85 |
Minimum CMRR (dB)
|
80 |
Minimum CMRR Range (dB)
|
80 to 85 |
Typical Gain Bandwidth Product (MHz)
|
170(Min) |
Typical Settling Time (ns)
|
42 |
Shut Down Support
|
No |
Operating Temperature-Min
|
-55 |
Operating Temperature-Max
|
125 |
Supplier Temperature Grade
|
Military |
Packing Method
|
Tray |
Pin Count
|
10 |
Standard Package Method
|
SOP |
Original Package
|
CSOIC |
Terminal Form
|
Surface Mount |
Package Height
|
1.78 |
Package Length
|
6.86(Max) |
Package Width
|
6.12 |
PCB changed
|
10 |