1206SFF250F/32-2

SKU: 114571

Manufacturer: TE Connectivity

Fuse Chip Fast Acting 2.5A 32V SMD Solder Pad 1206 Ceramic T/R

1740 parts IN STOCK

Shipped from :

Netherlands

Expected Ships :

Rohs State : Need to verify

Increments of 0 pcs

Products specifications

EU RoHS	Compliant
ECCN (US)	EAR99
Part Status	Obsolete
Automotive	No
PPAP	No
Type	Chip
Acting	Fast
Application	Cell Phones
Fuse Size (mm)	3.2 X 1.6 X 1.1
Current Rating (A)	2.5
Voltage Rating (V)	32
Maximum DC Voltage Rating (V)	32
Breaking Capacity @ Rated Voltage (A)	50@32VDC
Typical Melting I2t (A²S)	0.14
Typical Cold Resistance (Ohm)	0.035
Terminal Form	Solder Pad
Number of Terminals	2
Operating Temperature-Min	-55
Operating Temperature-Max	125
Depth (mm)	1.6
Length (mm)	3.2
Height (mm)	1.1
Fuse Body Material	Ceramic
Terminal Form	Surface Mount

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Products specifications

EU RoHS	Compliant
ECCN (US)	EAR99
Part Status	Obsolete
Automotive	No
PPAP	No
Type	Chip
Acting	Fast
Application	Cell Phones
Fuse Size (mm)	3.2 X 1.6 X 1.1
Current Rating (A)	2.5
Voltage Rating (V)	32
Maximum DC Voltage Rating (V)	32
Breaking Capacity @ Rated Voltage (A)	50@32VDC
Typical Melting I2t (A²S)	0.14
Typical Cold Resistance (Ohm)	0.035
Terminal Form	Solder Pad
Number of Terminals	2
Operating Temperature-Min	-55
Operating Temperature-Max	125
Depth (mm)	1.6
Length (mm)	3.2
Height (mm)	1.1
Fuse Body Material	Ceramic
Terminal Form	Surface Mount