EU RoHS
|
Compliant |
ECCN (US)
|
EAR99 |
Part Status
|
Active |
HTS
|
8541.40.80.00 |
Automotive
|
No |
PPAP
|
No |
Type
|
General Purpose |
Number of Channels per Chip
|
3 |
Maximum Data Rate
|
150Mbps |
Maximum Rise Time (ns)
|
4 |
Maximum Fall Time (ns)
|
4 |
Minimum Pulse Width (ns)
|
5 |
Maximum Pulse Width Distortion (ns)
|
4.5 |
Maximum Propagation Delay Skew (ns)
|
5 |
Output Type
|
CMOS |
Operating Supply Voltage-Max (V)
|
5.5 |
Operating Supply Voltage-Min (V)
|
2.5 |
Maximum Propagation Delay Time (tPHL) (ns)
|
14 |
Minimum Isolation Voltage (Vrms)
|
5000 |
Maximum Propagation Delay Time (tPLH) (ns)
|
13 |
Maximum Working Insulation Voltage
|
1200Vp |
Maximum Quiescent Supply Current (mA)
|
8.8/13.4 |
Maximum Output Current Drive (mA)
|
10 |
Maximum Power Dissipation (mW)
|
275 |
Operating Temperature-Min
|
-40 |
Operating Temperature-Max
|
125 |
Typical Operating Supply Voltage (V)
|
3.3 |
Forward/Reverse Channels
|
2/1 |
Minimum Common Mode Rejection (kV/us)
|
35 |
Coupling Type
|
Capacitive Coupling |
Original Package
|
SOIC W |
Pin Count
|
16 |
Terminal Form
|
Surface Mount |
Package Height
|
2.05(Min) |
Package Length
|
10.3 |
Package Width
|
7.5 |