KLMCG8GEND-B031

SKU: 96934

Manufacturer: Samsung Electronics

MLC NAND Flash Serial e-MMC 3V/3.3V 512G-bit 512G/128G/64G x 1/4-bit/8-bit 153-Pin FBGA

2730 parts IN STOCK

Shipped from :

Netherlands

Expected Ships :

Rohs State : Need to verify

Increments of 0 pcs

Products specifications

EU RoHS	Supplier Unconfirmed
Part Status	Obsolete
Automotive	No
PPAP	No
Cell Type	MLC NAND
Chip Density (bit)	512G
Architecture	Sectored
Boot Block	Yes
Number of Bits/Word (bit)	1/4/8
Number of Words	512G/128G/64G
Programmability	Yes
Timing Type	Synchronous
Maximum Erase Time (s)	0.02
Interface Type	Serial e-MMC
Operating Supply Voltage-Min (V)	2.7
Maximum Operating Frequency (MHz)	200
Typical Operating Supply Voltage (V)	3
Operating Supply Voltage-Max (V)	3.6
Operating Temperature-Min	-25
Operating Temperature-Max	85
Command Compatible	Yes
ECC Support	Yes
Support of Page Mode	No
Original Package	FBGA
Pin Count	153
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	0.68
Package Length	13
Package Width	11.5
PCB changed	153

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Products specifications

EU RoHS	Supplier Unconfirmed
Part Status	Obsolete
Automotive	No
PPAP	No
Cell Type	MLC NAND
Chip Density (bit)	512G
Architecture	Sectored
Boot Block	Yes
Number of Bits/Word (bit)	1/4/8
Number of Words	512G/128G/64G
Programmability	Yes
Timing Type	Synchronous
Maximum Erase Time (s)	0.02
Interface Type	Serial e-MMC
Operating Supply Voltage-Min (V)	2.7
Maximum Operating Frequency (MHz)	200
Typical Operating Supply Voltage (V)	3
Operating Supply Voltage-Max (V)	3.6
Operating Temperature-Min	-25
Operating Temperature-Max	85
Command Compatible	Yes
ECC Support	Yes
Support of Page Mode	No
Original Package	FBGA
Pin Count	153
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	0.68
Package Length	13
Package Width	11.5
PCB changed	153