K4X51323PK-8GD8

SKU: 40435

Manufacturer: Samsung Electronics

DRAM Chip Mobile-DDR SDRAM 512Mbit 16Mx32 1.8V 90-Pin FBGA

3340 parts IN STOCK

Shipped from :

Netherlands

Expected Ships :

Rohs State : Need to verify

Increments of 0 pcs

Products specifications

EU RoHS	Compliant
ECCN (US)	EAR99
Part Status	Unconfirmed
Automotive	No
PPAP	No
DRAM Type	Mobile-DDR SDRAM
Chip Density (bit)	512M
Organization	16Mx32
Number of Internal Banks	4
Number of Words per Bank	4M
Number of Bits/Word (bit)	32
Data Bus Width (bit)	32
Maximum Clock Rate (MHz)	400
Maximum Access Time (ns)	8
Address Bus Width (bit)	15
Interface Type	LVCMOS
Operating Supply Voltage-Min (V)	1.7
Typical Operating Supply Voltage (V)	1.8
Operating Supply Voltage-Max (V)	1.95
Operating Current (mA)	95
Operating Temperature-Min	-25
Operating Temperature-Max	85
Supplier Temperature Grade	Extended
Number of I/O Lines (bit)	32
Original Package	FBGA
Pin Count	90
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	0.58
Package Length	13
Package Width	8
PCB changed	90

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Products specifications

EU RoHS	Compliant
ECCN (US)	EAR99
Part Status	Unconfirmed
Automotive	No
PPAP	No
DRAM Type	Mobile-DDR SDRAM
Chip Density (bit)	512M
Organization	16Mx32
Number of Internal Banks	4
Number of Words per Bank	4M
Number of Bits/Word (bit)	32
Data Bus Width (bit)	32
Maximum Clock Rate (MHz)	400
Maximum Access Time (ns)	8
Address Bus Width (bit)	15
Interface Type	LVCMOS
Operating Supply Voltage-Min (V)	1.7
Typical Operating Supply Voltage (V)	1.8
Operating Supply Voltage-Max (V)	1.95
Operating Current (mA)	95
Operating Temperature-Min	-25
Operating Temperature-Max	85
Supplier Temperature Grade	Extended
Number of I/O Lines (bit)	32
Original Package	FBGA
Pin Count	90
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	0.58
Package Length	13
Package Width	8
PCB changed	90