K4T51163QJ-BCF7000

SKU: 146524

Manufacturer: Samsung Electronics

DRAM Chip DDR2 SDRAM 512Mbit 32Mx16 1.8V 84-Pin FBGA

2460 parts IN STOCK

Shipped from :

Netherlands

Expected Ships :

Rohs State : Need to verify

Increments of 0 pcs

Products specifications

EU RoHS	Compliant
ECCN (US)	EAR99
Part Status	Obsolete
HTS	8542.32.00.28
Automotive	No
PPAP	No
DRAM Type	DDR2 SDRAM
Chip Density (bit)	512M
Organization	32Mx16
Number of Internal Banks	4
Number of Words per Bank	8M
Number of Bits/Word (bit)	16
Data Bus Width (bit)	16
Maximum Clock Rate (MHz)	800
Maximum Access Time (ns)	0.4
Address Bus Width (bit)	15
Interface Type	SSTL_1.8
Operating Supply Voltage-Min (V)	1.7
Typical Operating Supply Voltage (V)	1.8
Operating Supply Voltage-Max (V)	1.9
Operating Current (mA)	130
Operating Temperature-Min	0
Operating Temperature-Max	95
Supplier Temperature Grade	Commercial
Number of I/O Lines (bit)	16
Original Package	FBGA
Pin Count	84
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	0.73
Package Length	12.5
Package Width	7.5
PCB changed	84

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Products specifications

EU RoHS	Compliant
ECCN (US)	EAR99
Part Status	Obsolete
HTS	8542.32.00.28
Automotive	No
PPAP	No
DRAM Type	DDR2 SDRAM
Chip Density (bit)	512M
Organization	32Mx16
Number of Internal Banks	4
Number of Words per Bank	8M
Number of Bits/Word (bit)	16
Data Bus Width (bit)	16
Maximum Clock Rate (MHz)	800
Maximum Access Time (ns)	0.4
Address Bus Width (bit)	15
Interface Type	SSTL_1.8
Operating Supply Voltage-Min (V)	1.7
Typical Operating Supply Voltage (V)	1.8
Operating Supply Voltage-Max (V)	1.9
Operating Current (mA)	130
Operating Temperature-Min	0
Operating Temperature-Max	95
Supplier Temperature Grade	Commercial
Number of I/O Lines (bit)	16
Original Package	FBGA
Pin Count	84
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	0.73
Package Length	12.5
Package Width	7.5
PCB changed	84