K4S641633H-RN75000

SKU: 58907

Manufacturer: Samsung Electronics

DRAM Chip Mobile SDRAM 64Mbit 4Mx16 3V 50-Pin FBGA Tray

1390 parts IN STOCK

Shipped from :

Netherlands

Expected Ships :

Rohs State : Need to verify

Increments of 0 pcs

Products specifications

EU RoHS	Not Compliant
ECCN (US)	EAR99
Part Status	Obsolete
Automotive	No
PPAP	No
DRAM Type	Mobile SDRAM
Chip Density (bit)	64M
Organization	4Mx16
Number of Internal Banks	4
Number of Words per Bank	1M
Number of Bits/Word (bit)	16
Data Bus Width (bit)	16
Maximum Clock Rate (MHz)	133
Maximum Access Time (ns)	7
Address Bus Width (bit)	14
Interface Type	LVCMOS
Operating Supply Voltage-Min (V)	2.7
Typical Operating Supply Voltage (V)	3
Operating Supply Voltage-Max (V)	3.6
Operating Current (mA)	90
Operating Temperature-Min	-25
Operating Temperature-Max	85
Supplier Temperature Grade	Extended
Number of I/O Lines (bit)	16
Packing Method	Tray
Original Package	FBGA
Pin Count	50
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	1
Package Length	20.95
Package Width	10.16
PCB changed	50

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Products specifications

EU RoHS	Not Compliant
ECCN (US)	EAR99
Part Status	Obsolete
Automotive	No
PPAP	No
DRAM Type	Mobile SDRAM
Chip Density (bit)	64M
Organization	4Mx16
Number of Internal Banks	4
Number of Words per Bank	1M
Number of Bits/Word (bit)	16
Data Bus Width (bit)	16
Maximum Clock Rate (MHz)	133
Maximum Access Time (ns)	7
Address Bus Width (bit)	14
Interface Type	LVCMOS
Operating Supply Voltage-Min (V)	2.7
Typical Operating Supply Voltage (V)	3
Operating Supply Voltage-Max (V)	3.6
Operating Current (mA)	90
Operating Temperature-Min	-25
Operating Temperature-Max	85
Supplier Temperature Grade	Extended
Number of I/O Lines (bit)	16
Packing Method	Tray
Original Package	FBGA
Pin Count	50
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	1
Package Length	20.95
Package Width	10.16
PCB changed	50