K4M56323PI-HG75

SKU: 54698

Manufacturer: Samsung Electronics

DRAM Chip Mobile SDRAM 256Mbit 8Mx32 1.8V 54-Pin FBGA

860 parts IN STOCK

Shipped from :

Netherlands

Expected Ships :

Rohs State : Need to verify

Increments of 0 pcs

Products specifications

EU RoHS	Compliant
ECCN (US)	EAR99
Part Status	Obsolete
Automotive	No
PPAP	No
DRAM Type	Mobile SDRAM
Chip Density (bit)	256M
Organization	8Mx32
Number of Bits/Word (bit)	32
Data Bus Width (bit)	32
Typical Operating Supply Voltage (V)	1.8
Number of I/O Lines (bit)	32
Original Package	FBGA
Pin Count	54
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	0.6
Package Length	8
Package Width	8
PCB changed	54

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Products specifications

EU RoHS	Compliant
ECCN (US)	EAR99
Part Status	Obsolete
Automotive	No
PPAP	No
DRAM Type	Mobile SDRAM
Chip Density (bit)	256M
Organization	8Mx32
Number of Bits/Word (bit)	32
Data Bus Width (bit)	32
Typical Operating Supply Voltage (V)	1.8
Number of I/O Lines (bit)	32
Original Package	FBGA
Pin Count	54
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	0.6
Package Length	8
Package Width	8
PCB changed	54