K4E6E304EB-EGCF

SKU: 111094

Manufacturer: Samsung Electronics

DRAM Chip Mobile LPDDR3 SDRAM 16Gbit 512Mx32 1.2V/1.8V 178-Pin FBGA

270 parts IN STOCK

Shipped from :

Netherlands

Expected Ships :

Rohs State : Need to verify

Increments of 0 pcs

Products specifications

EU RoHS	Supplier Unconfirmed
ECCN (US)	EAR99
Part Status	Active
HTS	8542.32.00.02
Automotive	No
PPAP	No
DRAM Type	Mobile LPDDR3 SDRAM
Chip Density (bit)	16G
Organization	512Mx32
Number of Internal Banks	8
Number of Words per Bank	64M
Number of Bits/Word (bit)	32
Data Bus Width (bit)	32
Maximum Clock Rate (MHz)	1866
Typical Operating Supply Voltage (V)	1.2
Operating Temperature-Min	-25
Operating Temperature-Max	70
Supplier Temperature Grade	Commercial
Number of I/O Lines (bit)	32
Original Package	FBGA
Pin Count	178
Terminal Form	Surface Mount
Package Length	11.5
Package Width	11

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Products specifications

EU RoHS	Supplier Unconfirmed
ECCN (US)	EAR99
Part Status	Active
HTS	8542.32.00.02
Automotive	No
PPAP	No
DRAM Type	Mobile LPDDR3 SDRAM
Chip Density (bit)	16G
Organization	512Mx32
Number of Internal Banks	8
Number of Words per Bank	64M
Number of Bits/Word (bit)	32
Data Bus Width (bit)	32
Maximum Clock Rate (MHz)	1866
Typical Operating Supply Voltage (V)	1.2
Operating Temperature-Min	-25
Operating Temperature-Max	70
Supplier Temperature Grade	Commercial
Number of I/O Lines (bit)	32
Original Package	FBGA
Pin Count	178
Terminal Form	Surface Mount
Package Length	11.5
Package Width	11