K4B2G1646F-BCNB

SKU: 19199

Manufacturer: Samsung Electronics

DRAM Chip DDR3 SDRAM 2Gbit 128Mx16 1.5V 96-Pin FBGA

4060 parts IN STOCK

Shipped from :

Netherlands

Expected Ships :

Rohs State : Need to verify

Increments of 0 pcs

Products specifications

EU RoHS	Compliant
ECCN (US)	EAR99
Part Status	Active
HTS	8542.32.00.36
Automotive	No
PPAP	No
DRAM Type	DDR3 SDRAM
Chip Density (bit)	2G
Organization	128Mx16
Number of Internal Banks	8
Number of Words per Bank	16M
Number of Bits/Word (bit)	16
Data Bus Width (bit)	16
Maximum Clock Rate (MHz)	2133
Maximum Access Time (ns)	0.18
Address Bus Width (bit)	17
Interface Type	SSTL_1.5
Operating Supply Voltage-Min (V)	1.425
Typical Operating Supply Voltage (V)	1.5
Operating Supply Voltage-Max (V)	1.575
Operating Current (mA)	145
Operating Temperature-Min	0
Operating Temperature-Max	95
Number of I/O Lines (bit)	16
Original Package	FBGA
Pin Count	96
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Length	13.3
Package Width	7.5
PCB changed	96

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Products specifications

EU RoHS	Compliant
ECCN (US)	EAR99
Part Status	Active
HTS	8542.32.00.36
Automotive	No
PPAP	No
DRAM Type	DDR3 SDRAM
Chip Density (bit)	2G
Organization	128Mx16
Number of Internal Banks	8
Number of Words per Bank	16M
Number of Bits/Word (bit)	16
Data Bus Width (bit)	16
Maximum Clock Rate (MHz)	2133
Maximum Access Time (ns)	0.18
Address Bus Width (bit)	17
Interface Type	SSTL_1.5
Operating Supply Voltage-Min (V)	1.425
Typical Operating Supply Voltage (V)	1.5
Operating Supply Voltage-Max (V)	1.575
Operating Current (mA)	145
Operating Temperature-Min	0
Operating Temperature-Max	95
Number of I/O Lines (bit)	16
Original Package	FBGA
Pin Count	96
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Length	13.3
Package Width	7.5
PCB changed	96