K4B2G1646E-BCK0

SKU: 103945

Manufacturer: Samsung Electronics

DRAM Chip DDR3 SDRAM 2Gbit 128Mx16 1.5V 96-Pin FBGA

3150 parts IN STOCK

Shipped from :

Netherlands

Expected Ships :

Rohs State : Need to verify

Increments of 0 pcs

Products specifications

EU RoHS	Compliant
ECCN (US)	EAR99
Part Status	Obsolete
Automotive	No
PPAP	No
DRAM Type	DDR3 SDRAM
Chip Density (bit)	2G
Organization	128Mx16
Number of Internal Banks	8
Number of Words per Bank	16M
Number of Bits/Word (bit)	16
Data Bus Width (bit)	16
Maximum Clock Rate (MHz)	1600
Maximum Access Time (ns)	0.225
Address Bus Width (bit)	17
Interface Type	SSTL_1.5
Operating Supply Voltage-Min (V)	1.425
Typical Operating Supply Voltage (V)	1.5
Operating Supply Voltage-Max (V)	1.575
Operating Current (mA)	131
Operating Temperature-Min	0
Operating Temperature-Max	95
Supplier Temperature Grade	Commercial
Number of I/O Lines (bit)	16
Original Package	FBGA
Pin Count	96
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Length	13.3
Package Width	7.5
PCB changed	96

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Products specifications

EU RoHS	Compliant
ECCN (US)	EAR99
Part Status	Obsolete
Automotive	No
PPAP	No
DRAM Type	DDR3 SDRAM
Chip Density (bit)	2G
Organization	128Mx16
Number of Internal Banks	8
Number of Words per Bank	16M
Number of Bits/Word (bit)	16
Data Bus Width (bit)	16
Maximum Clock Rate (MHz)	1600
Maximum Access Time (ns)	0.225
Address Bus Width (bit)	17
Interface Type	SSTL_1.5
Operating Supply Voltage-Min (V)	1.425
Typical Operating Supply Voltage (V)	1.5
Operating Supply Voltage-Max (V)	1.575
Operating Current (mA)	131
Operating Temperature-Min	0
Operating Temperature-Max	95
Supplier Temperature Grade	Commercial
Number of I/O Lines (bit)	16
Original Package	FBGA
Pin Count	96
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Length	13.3
Package Width	7.5
PCB changed	96