K4B2G0846D-HYK0

SKU: 51860

Manufacturer: Samsung Electronics

DRAM Chip DDR3L SDRAM 2Gbit 256Mx8 1.35V/1.5V 78-Pin FBGA

350 parts IN STOCK

Shipped from :

Netherlands

Expected Ships :

Rohs State : Need to verify

Increments of 0 pcs

Products specifications

EU RoHS	Compliant
ECCN (US)	EAR99
Part Status	Obsolete
Automotive	No
PPAP	No
DRAM Type	DDR3L SDRAM
Chip Density (bit)	2G
Organization	256Mx8
Number of Internal Banks	8
Number of Words per Bank	32M
Number of Bits/Word (bit)	8
Data Bus Width (bit)	8
Maximum Clock Rate (MHz)	1600
Maximum Access Time (ns)	0.225
Address Bus Width (bit)	18
Interface Type	SSTL_1.5
Operating Supply Voltage-Min (V)	1.283
Typical Operating Supply Voltage (V)	1.35
Operating Supply Voltage-Max (V)	1.45
Operating Current (mA)	90
Operating Temperature-Min	0
Operating Temperature-Max	95
Number of I/O Lines (bit)	8
Original Package	FBGA
Pin Count	78
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	0.75
Package Length	11
Package Width	7.5
PCB changed	78

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Products specifications

EU RoHS	Compliant
ECCN (US)	EAR99
Part Status	Obsolete
Automotive	No
PPAP	No
DRAM Type	DDR3L SDRAM
Chip Density (bit)	2G
Organization	256Mx8
Number of Internal Banks	8
Number of Words per Bank	32M
Number of Bits/Word (bit)	8
Data Bus Width (bit)	8
Maximum Clock Rate (MHz)	1600
Maximum Access Time (ns)	0.225
Address Bus Width (bit)	18
Interface Type	SSTL_1.5
Operating Supply Voltage-Min (V)	1.283
Typical Operating Supply Voltage (V)	1.35
Operating Supply Voltage-Max (V)	1.45
Operating Current (mA)	90
Operating Temperature-Min	0
Operating Temperature-Max	95
Number of I/O Lines (bit)	8
Original Package	FBGA
Pin Count	78
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	0.75
Package Length	11
Package Width	7.5
PCB changed	78