K4A8G085WB-BIRC

SKU: 33292

Manufacturer: Samsung Electronics

DRAM Chip DDR4 SDRAM 8Gbit 1Gx8 1.2V 78-Pin FBGA

3510 parts IN STOCK

Shipped from :

Netherlands

Expected Ships :

Rohs State : Need to verify

Increments of 0 pcs

Products specifications

EU RoHS	Compliant
ECCN (US)	EAR99
Part Status	Active
HTS	8542.32.00.36
Automotive	No
PPAP	No
DRAM Type	DDR4 SDRAM
Chip Density (bit)	8G
Organization	1Gx8
Number of Internal Banks	16
Number of Words per Bank	64M
Number of Bits/Word (bit)	8
Data Bus Width (bit)	8
Maximum Clock Rate (MHz)	2400
Maximum Access Time (ns)	0.175
Address Bus Width (bit)	18
Interface Type	POD
Operating Supply Voltage-Min (V)	1.14
Typical Operating Supply Voltage (V)	1.2
Operating Supply Voltage-Max (V)	1.26
Operating Current (mA)	107
Operating Temperature-Min	-40
Operating Temperature-Max	95
Supplier Temperature Grade	Industrial
Number of I/O Lines (bit)	8
Original Package	FBGA
Pin Count	78
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Length	11
Package Width	7.5
PCB changed	78

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Products specifications

EU RoHS	Compliant
ECCN (US)	EAR99
Part Status	Active
HTS	8542.32.00.36
Automotive	No
PPAP	No
DRAM Type	DDR4 SDRAM
Chip Density (bit)	8G
Organization	1Gx8
Number of Internal Banks	16
Number of Words per Bank	64M
Number of Bits/Word (bit)	8
Data Bus Width (bit)	8
Maximum Clock Rate (MHz)	2400
Maximum Access Time (ns)	0.175
Address Bus Width (bit)	18
Interface Type	POD
Operating Supply Voltage-Min (V)	1.14
Typical Operating Supply Voltage (V)	1.2
Operating Supply Voltage-Max (V)	1.26
Operating Current (mA)	107
Operating Temperature-Min	-40
Operating Temperature-Max	95
Supplier Temperature Grade	Industrial
Number of I/O Lines (bit)	8
Original Package	FBGA
Pin Count	78
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Length	11
Package Width	7.5
PCB changed	78