K4A4G165WF-BCTD

SKU: 82755

Manufacturer: Samsung Electronics

DRAM Chip DDR4 SDRAM 4Gbit 256Mx16 1.2V 96-Pin FBGA

1820 parts IN STOCK

Shipped from :

Netherlands

Expected Ships :

Rohs State : Need to verify

Increments of 0 pcs

Products specifications

EU RoHS	Compliant
ECCN (US)	EAR99
Part Status	Active
HTS	8542.32.00.36
DRAM Type	DDR4 SDRAM
Chip Density (bit)	4G
Organization	256Mx16
Number of Internal Banks	16
Number of Words per Bank	16M
Number of Bits/Word (bit)	16
Data Bus Width (bit)	16
Maximum Clock Rate (MHz)	2666
Interface Type	POD
Typical Operating Supply Voltage (V)	1.2
Operating Temperature-Min	0
Operating Temperature-Max	85
Supplier Temperature Grade	Commercial
Number of I/O Lines (bit)	16
Original Package	FBGA
Pin Count	96
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	0.98(Max)
Package Length	13.3
Package Width	10.3
PCB changed	96

Your name

Your email

Enquiry

Products specifications

EU RoHS	Compliant
ECCN (US)	EAR99
Part Status	Active
HTS	8542.32.00.36
DRAM Type	DDR4 SDRAM
Chip Density (bit)	4G
Organization	256Mx16
Number of Internal Banks	16
Number of Words per Bank	16M
Number of Bits/Word (bit)	16
Data Bus Width (bit)	16
Maximum Clock Rate (MHz)	2666
Interface Type	POD
Typical Operating Supply Voltage (V)	1.2
Operating Temperature-Min	0
Operating Temperature-Max	85
Supplier Temperature Grade	Commercial
Number of I/O Lines (bit)	16
Original Package	FBGA
Pin Count	96
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	0.98(Max)
Package Length	13.3
Package Width	10.3
PCB changed	96