SI4542DY

SKU: 14313

Manufacturer: onsemi

Trans MOSFET N/P-CH 30V 6A 8-Pin SOIC T/R

480 parts IN STOCK

Shipped from :

Netherlands

Expected Ships :

Rohs State : Need to verify

Increments of 0 pcs

Products specifications

EU RoHS	Compliant
ECCN (US)	EAR99
Part Status	Obsolete
HTS	8541.29.00.95
Automotive	No
PPAP	No
Product Category	Power MOSFET
Process Technology	TMOS
Configuration	Dual Dual Drain
Channel Mode	Enhancement
Channel Type	P
Number of Elements per pcs	2
Maximum Drain Source Voltage (V)	30
Maximum Gate Source Voltage (V)	±20
Maximum Continuous Drain Current (A)	6
Maximum Drain Source Resistance (mOhm)	28@10V@N Channel
Typical Gate Charge @ Vgs (nC)	15@5V@P Channel
Typical Input Capacitance @ Vds (pF)	830@15V@N Channel
Maximum Power Dissipation (mW)	2000
Typical Fall Time (ns)	18@P Channel
Typical Rise Time (ns)	22@P Channel
Typical Turn-Off Delay Time (ns)	47@P Channel
Typical Turn-On Delay Time (ns)	13@P Channel
Operating Temperature-Min	-55
Operating Temperature-Max	175
Packing Method	Tape and Reel
Pin Count	8
Standard Package Method	SOP
Original Package	SOIC
Terminal Form	Surface Mount
Package Height	1.5(Max)
Package Length	4.9
Package Width	3.9
PCB changed	8

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Products specifications

EU RoHS	Compliant
ECCN (US)	EAR99
Part Status	Obsolete
HTS	8541.29.00.95
Automotive	No
PPAP	No
Product Category	Power MOSFET
Process Technology	TMOS
Configuration	Dual Dual Drain
Channel Mode	Enhancement
Channel Type	P
Number of Elements per pcs	2
Maximum Drain Source Voltage (V)	30
Maximum Gate Source Voltage (V)	±20
Maximum Continuous Drain Current (A)	6
Maximum Drain Source Resistance (mOhm)	28@10V@N Channel
Typical Gate Charge @ Vgs (nC)	15@5V@P Channel
Typical Input Capacitance @ Vds (pF)	830@15V@N Channel
Maximum Power Dissipation (mW)	2000
Typical Fall Time (ns)	18@P Channel
Typical Rise Time (ns)	22@P Channel
Typical Turn-Off Delay Time (ns)	47@P Channel
Typical Turn-On Delay Time (ns)	13@P Channel
Operating Temperature-Min	-55
Operating Temperature-Max	175
Packing Method	Tape and Reel
Pin Count	8
Standard Package Method	SOP
Original Package	SOIC
Terminal Form	Surface Mount
Package Height	1.5(Max)
Package Length	4.9
Package Width	3.9
PCB changed	8