MRF300AN

SKU: 63250

Manufacturer: NXP Semiconductors

Trans RF FET N-CH 133V 3-Pin(3+Tab) TO-247 Tube

1200 parts IN STOCK

Shipped from :

Netherlands

Expected Ships :

Rohs State : Need to verify

Increments of 0 pcs

Products specifications

EU RoHS	Compliant
ECCN (US)	EAR99
Part Status	Active
HTS	8541.29.00.75
SVHC	Yes
Automotive	No
PPAP	No
Configuration	Single
Type	MOSFET
Channel Mode	Enhancement
Channel Type	N
Number of Elements per pcs	1
Mode of Operation	CW
Process Technology	LDMOS
Maximum Drain Source Voltage (V)	133
Maximum Gate Source Voltage (V)	10
Maximum VSWR	65
Typical Input Capacitance @ Vds (pF)	403@50V
Typical Reverse Transfer Capacitance @ Vds (pF)	2.31@50V
Typical Output Capacitance @ Vds (pF)	104@50V
Typical Forward Transconductance (S)	28
Maximum Power Dissipation (mW)	272000
Output Power (W)	330(Typ)
Typical Power Gain (dB)	28.2
Maximum Frequency (MHz)	250
Minimum Frequency (MHz)	1.8
Typical Drain Efficiency (%)	75.5
Operating Temperature-Min	-40
Operating Temperature-Max	125
Packing Method	Tube
Original Package	TO-247
Pin Count	3
Terminal Form	Through Hole
Package Height	21.11(Max)
Package Length	16.13(Max)
Package Width	5.21(Max)
PCB changed	3

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Products specifications

EU RoHS	Compliant
ECCN (US)	EAR99
Part Status	Active
HTS	8541.29.00.75
SVHC	Yes
Automotive	No
PPAP	No
Configuration	Single
Type	MOSFET
Channel Mode	Enhancement
Channel Type	N
Number of Elements per pcs	1
Mode of Operation	CW
Process Technology	LDMOS
Maximum Drain Source Voltage (V)	133
Maximum Gate Source Voltage (V)	10
Maximum VSWR	65
Typical Input Capacitance @ Vds (pF)	403@50V
Typical Reverse Transfer Capacitance @ Vds (pF)	2.31@50V
Typical Output Capacitance @ Vds (pF)	104@50V
Typical Forward Transconductance (S)	28
Maximum Power Dissipation (mW)	272000
Output Power (W)	330(Typ)
Typical Power Gain (dB)	28.2
Maximum Frequency (MHz)	250
Minimum Frequency (MHz)	1.8
Typical Drain Efficiency (%)	75.5
Operating Temperature-Min	-40
Operating Temperature-Max	125
Packing Method	Tube
Original Package	TO-247
Pin Count	3
Terminal Form	Through Hole
Package Height	21.11(Max)
Package Length	16.13(Max)
Package Width	5.21(Max)
PCB changed	3