MPC860TZQ50D4

SKU: 20658

Manufacturer: NXP Semiconductors

MPU PowerQUICC MPC8xx Processor RISC 32bit 0.32um 50MHz 357-Pin BGA Tray

50 parts IN STOCK

Shipped from :

Netherlands

Expected Ships :

Rohs State : Need to verify

Increments of 0 pcs

Products specifications

EU RoHS	Not Compliant
ECCN (US)	3A991A2
Part Status	Obsolete
HTS	8542.31.00.01
SVHC	Yes
SVHC Exceeds Threshold	Yes
Automotive	No
PPAP	No
Family Name	PowerQUICC MPC8xx Processor
Instruction Set Architecture	RISC
Device Core	MPC8xx
Number of CPU Cores	1
Data Bus Width (bit)	32
Instruction Cache Size	4KB
On-Chip Memory	8KB/RAM
Maximum Speed (MHz)	50
Interface Type	Ethernet/I2C/SPI/UART
UART	1
USART	0
Data Cache Size	4KB
USB	0
Multiply Accumulate	No
SPI	1
I2C	1
I2S	0
CAN	0
Ethernet	1
Ethernet Interface Type	MII
Ethernet Speed	10Mbps/100Mbps
Operating Supply Voltage-Min (V)	2
Typical Operating Supply Voltage (V)	3.3
Operating Supply Voltage-Max (V)	3.6
Maximum Power Dissipation (mW)	735
Operating Temperature-Min	0
Operating Temperature-Max	95
Supplier Temperature Grade	Extended
Packing Method	Tray
Original Package	BGA
Pin Count	357
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	1.82(Max)
Package Length	25
Package Width	25
PCB changed	357

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Products specifications

EU RoHS	Not Compliant
ECCN (US)	3A991A2
Part Status	Obsolete
HTS	8542.31.00.01
SVHC	Yes
SVHC Exceeds Threshold	Yes
Automotive	No
PPAP	No
Family Name	PowerQUICC MPC8xx Processor
Instruction Set Architecture	RISC
Device Core	MPC8xx
Number of CPU Cores	1
Data Bus Width (bit)	32
Instruction Cache Size	4KB
On-Chip Memory	8KB/RAM
Maximum Speed (MHz)	50
Interface Type	Ethernet/I2C/SPI/UART
UART	1
USART	0
Data Cache Size	4KB
USB	0
Multiply Accumulate	No
SPI	1
I2C	1
I2S	0
CAN	0
Ethernet	1
Ethernet Interface Type	MII
Ethernet Speed	10Mbps/100Mbps
Operating Supply Voltage-Min (V)	2
Typical Operating Supply Voltage (V)	3.3
Operating Supply Voltage-Max (V)	3.6
Maximum Power Dissipation (mW)	735
Operating Temperature-Min	0
Operating Temperature-Max	95
Supplier Temperature Grade	Extended
Packing Method	Tray
Original Package	BGA
Pin Count	357
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	1.82(Max)
Package Length	25
Package Width	25
PCB changed	357