GS81284Z36B-250I

SKU: 51775

Manufacturer: NXP Semiconductors

SRAM Chip Sync Quad 2.5V/3.3V 144M-bit 4M x 36 6.5ns/2.5ns 119-Pin FBGA Tray

1630 parts IN STOCK

Shipped from :

Netherlands

Expected Ships :

Rohs State : Need to verify

Increments of 0 pcs

Products specifications

EU RoHS	Not Compliant
ECCN (US)	3A991.B.2.B
Part Status	Active
HTS	8542.32.00.41
Chip Density (bit)	144M
Number of Words	4M
Number of Bits/Word (bit)	36
Architecture	Flow-Through
Data Rate Architecture	SDR
Address Bus Width (bit)	22
Number of Ports	4
Timing Type	Synchronous
Max. Access Time (ns)	6.5@Flow-Through
Maximum Clock Rate (MHz)	153.8@Flow-Through
Operating Supply Voltage-Min (V)	2.3
Typical Operating Supply Voltage (V)	2.5
Operating Supply Voltage-Max (V)	2.7
Operating Current (mA)	415@Flow-Through
Operating Temperature-Min	-40
Operating Temperature-Max	85
Supplier Temperature Grade	Industrial
Packing Method	Tray
Original Package	FBGA
Pin Count	119
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	1.26
Package Length	22
Package Width	14
PCB changed	119

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Products specifications

EU RoHS	Not Compliant
ECCN (US)	3A991.B.2.B
Part Status	Active
HTS	8542.32.00.41
Chip Density (bit)	144M
Number of Words	4M
Number of Bits/Word (bit)	36
Architecture	Flow-Through
Data Rate Architecture	SDR
Address Bus Width (bit)	22
Number of Ports	4
Timing Type	Synchronous
Max. Access Time (ns)	6.5@Flow-Through
Maximum Clock Rate (MHz)	153.8@Flow-Through
Operating Supply Voltage-Min (V)	2.3
Typical Operating Supply Voltage (V)	2.5
Operating Supply Voltage-Max (V)	2.7
Operating Current (mA)	415@Flow-Through
Operating Temperature-Min	-40
Operating Temperature-Max	85
Supplier Temperature Grade	Industrial
Packing Method	Tray
Original Package	FBGA
Pin Count	119
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	1.26
Package Length	22
Package Width	14
PCB changed	119