PMV45EN2R

SKU: 129894

Manufacturer: Nexperia

Trans MOSFET N-CH 30V 4.1A 3-Pin SOT-23 T/R

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Products specifications

EU RoHS	Compliant
ECCN (US)	EAR99
Part Status	Active
HTS	8541.29.00.95
SVHC	Yes
Automotive	No
PPAP	No
Product Category	Small Signal
Configuration	Single
Process Technology	TMOS
Channel Mode	Enhancement
Channel Type	N
Number of Elements per pcs	1
Maximum Drain Source Voltage (V)	30
Maximum Gate Source Voltage (V)	20
Maximum Gate Threshold Voltage (V)	2
Operating Junction Temperature (°C)	-55 to 150
Maximum Continuous Drain Current (A)	4.1
Maximum Gate Source Leakage Current (nA)	100
Maximum IDSS (uA)	1
Maximum Drain Source Resistance (mOhm)	42@10V
Typical Gate Charge @ Vgs (nC)	3.6@10V
Typical Gate Charge @ 10V (nC)	3.6
Typical Gate to Drain Charge (nC)	0.4
Typical Gate to Source Charge (nC)	0.5
Typical Input Capacitance @ Vds (pF)	209@15V
Typical Reverse Transfer Capacitance @ Vds (pF)	17@15V
Minimum Gate Threshold Voltage (V)	1
Typical Output Capacitance (pF)	50
Maximum Power Dissipation (mW)	1115
Typical Fall Time (ns)	2
Typical Rise Time (ns)	12
Typical Turn-Off Delay Time (ns)	11
Typical Turn-On Delay Time (ns)	3
Operating Temperature-Min	-55
Operating Temperature-Max	150
Packing Method	Tape and Reel
Maximum Power Dissipation on PCB @ TC=25°C (W)	1.115
Maximum Pulsed Drain Current @ TC=25°C (A)	16
Typical Diode Forward Voltage (V)	0.8
Typical Gate Plateau Voltage (V)	2.6
Maximum Diode Forward Voltage (V)	1.2
Typical Gate Threshold Voltage (V)	1.5
Maximum Positive Gate Source Voltage (V)	20
Maximum Continuous Drain Current on PCB @ TC=25°C (A)	4.1
Original Package	SOT-23
Pin Count	3
Standard Package Method	SOT
Terminal Form	Surface Mount
Package Height	1(Max)
Package Length	3(Max)
Package Width	1.4(Max)
PCB changed	3

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Products specifications

EU RoHS	Compliant
ECCN (US)	EAR99
Part Status	Active
HTS	8541.29.00.95
SVHC	Yes
Automotive	No
PPAP	No
Product Category	Small Signal
Configuration	Single
Process Technology	TMOS
Channel Mode	Enhancement
Channel Type	N
Number of Elements per pcs	1
Maximum Drain Source Voltage (V)	30
Maximum Gate Source Voltage (V)	20
Maximum Gate Threshold Voltage (V)	2
Operating Junction Temperature (°C)	-55 to 150
Maximum Continuous Drain Current (A)	4.1
Maximum Gate Source Leakage Current (nA)	100
Maximum IDSS (uA)	1
Maximum Drain Source Resistance (mOhm)	42@10V
Typical Gate Charge @ Vgs (nC)	3.6@10V
Typical Gate Charge @ 10V (nC)	3.6
Typical Gate to Drain Charge (nC)	0.4
Typical Gate to Source Charge (nC)	0.5
Typical Input Capacitance @ Vds (pF)	209@15V
Typical Reverse Transfer Capacitance @ Vds (pF)	17@15V
Minimum Gate Threshold Voltage (V)	1
Typical Output Capacitance (pF)	50
Maximum Power Dissipation (mW)	1115
Typical Fall Time (ns)	2
Typical Rise Time (ns)	12
Typical Turn-Off Delay Time (ns)	11
Typical Turn-On Delay Time (ns)	3
Operating Temperature-Min	-55
Operating Temperature-Max	150
Packing Method	Tape and Reel
Maximum Power Dissipation on PCB @ TC=25°C (W)	1.115
Maximum Pulsed Drain Current @ TC=25°C (A)	16
Typical Diode Forward Voltage (V)	0.8
Typical Gate Plateau Voltage (V)	2.6
Maximum Diode Forward Voltage (V)	1.2
Typical Gate Threshold Voltage (V)	1.5
Maximum Positive Gate Source Voltage (V)	20
Maximum Continuous Drain Current on PCB @ TC=25°C (A)	4.1
Original Package	SOT-23
Pin Count	3
Standard Package Method	SOT
Terminal Form	Surface Mount
Package Height	1(Max)
Package Length	3(Max)
Package Width	1.4(Max)
PCB changed	3