NT6CL256T32BM-H2

SKU: 27899

Manufacturer: Nanya Technology

DRAM Chip Mobile LPDDR3 SDRAM 8Gbit 256Mx32 1.8V/1.2V 178-Pin FBGA

2150 parts IN STOCK

Shipped from :

Netherlands

Expected Ships :

Rohs State : Need to verify

Increments of 0 pcs

Products specifications

EU RoHS	Compliant
ECCN (US)	EAR99
Part Status	Active
HTS	8542.32.00.36
Automotive	Unknown
PPAP	Unknown
DRAM Type	Mobile LPDDR3 SDRAM
Chip Density (bit)	8G
Organization	256Mx32
Number of Internal Banks	8
Number of Words per Bank	32M
Number of Bits/Word (bit)	32
Data Bus Width (bit)	32
Maximum Clock Rate (MHz)	1600
Maximum Access Time (ns)	5.5
Address Bus Width (bit)	17
Interface Type	HSUL_12
Operating Supply Voltage-Min (V)	1.7
Typical Operating Supply Voltage (V)	1.8
Operating Supply Voltage-Max (V)	1.95
Operating Current (mA)	600
Operating Temperature-Min	-25
Operating Temperature-Max	85
Supplier Temperature Grade	Commercial
Number of I/O Lines (bit)	32
Original Package	FBGA
Pin Count	178
Terminal Form	Surface Mount
Package Height	0.53(Max)
Package Length	11.5
Package Width	10.5

Your name

Your email

Enquiry

Products specifications

EU RoHS	Compliant
ECCN (US)	EAR99
Part Status	Active
HTS	8542.32.00.36
Automotive	Unknown
PPAP	Unknown
DRAM Type	Mobile LPDDR3 SDRAM
Chip Density (bit)	8G
Organization	256Mx32
Number of Internal Banks	8
Number of Words per Bank	32M
Number of Bits/Word (bit)	32
Data Bus Width (bit)	32
Maximum Clock Rate (MHz)	1600
Maximum Access Time (ns)	5.5
Address Bus Width (bit)	17
Interface Type	HSUL_12
Operating Supply Voltage-Min (V)	1.7
Typical Operating Supply Voltage (V)	1.8
Operating Supply Voltage-Max (V)	1.95
Operating Current (mA)	600
Operating Temperature-Min	-25
Operating Temperature-Max	85
Supplier Temperature Grade	Commercial
Number of I/O Lines (bit)	32
Original Package	FBGA
Pin Count	178
Terminal Form	Surface Mount
Package Height	0.53(Max)
Package Length	11.5
Package Width	10.5