EU RoHS
|
Compliant |
ECCN (US)
|
EAR99 |
Part Status
|
Active |
HTS
|
8542.32.00.36 |
DRAM Type
|
DDR3L SDRAM |
Chip Density (bit)
|
2G |
Organization
|
128Mx16 |
Number of Internal Banks
|
8 |
Number of Words per Bank
|
16M |
Number of Bits/Word (bit)
|
16 |
Data Bus Width (bit)
|
16 |
Maximum Clock Rate (MHz)
|
1866 |
Maximum Access Time (ns)
|
0.195 |
Address Bus Width (bit)
|
17 |
Interface Type
|
SSTL_135 |
Operating Supply Voltage-Min (V)
|
1.283 |
Typical Operating Supply Voltage (V)
|
1.35 |
Operating Supply Voltage-Max (V)
|
1.45 |
Operating Current (mA)
|
115 |
Operating Temperature-Min
|
0 |
Operating Temperature-Max
|
95 |
Supplier Temperature Grade
|
Commercial |
Number of I/O Lines (bit)
|
16 |
Original Package
|
TFBGA |
Pin Count
|
96 |
Standard Package Method
|
BGA |
Terminal Form
|
Surface Mount |
Package Height
|
1(Max) |
Package Length
|
13 |
Package Width
|
7.5 |
PCB changed
|
96 |