W3H128M72E-667NBM

SKU: 66741

Manufacturer: Microsemi

DRAM Module DDR2 SDRAM 1Gbyte

1980 parts IN STOCK

Shipped from :

Netherlands

Expected Ships :

Rohs State : Need to verify

Increments of 0 pcs

Products specifications

EU RoHS	Supplier Unconfirmed
ECCN (US)	4A994.a
Module	DRAM Module
Subcategory	DDR2 SDRAM
Module Density	1Gbyte
Organization	128Mx72
Number of Chip per Module	5
Chip Density (bit)	1.8G
Data Bus Width (bit)	72
Max. Access Time (ns)	1.25
Maximum Clock Rate (MHz)	667
Chip Package Type	PBGA
Operating Supply Voltage-Min (V)	1.7
Typical Operating Supply Voltage (V)	1.8
Operating Supply Voltage-Max (V)	1.9
Operating Current (mA)	1375
Operating Temperature-Min	-55
Operating Temperature-Max	125
Supplier Temperature Grade	Military
ECC Support	Yes
Number of Chip Banks	8
CAS Latency	6
PLL	No
SPD EEPROM Support	No
Self Refresh	Yes
Original Package	BGA
Pin Count	208
Terminal Form	Surface Mount
Package Height	3.94(Max)
Package Length	22.1(Max)
Package Width	16.1(Max)

Your name

Your email

Enquiry

Products specifications

EU RoHS	Supplier Unconfirmed
ECCN (US)	4A994.a
Module	DRAM Module
Subcategory	DDR2 SDRAM
Module Density	1Gbyte
Organization	128Mx72
Number of Chip per Module	5
Chip Density (bit)	1.8G
Data Bus Width (bit)	72
Max. Access Time (ns)	1.25
Maximum Clock Rate (MHz)	667
Chip Package Type	PBGA
Operating Supply Voltage-Min (V)	1.7
Typical Operating Supply Voltage (V)	1.8
Operating Supply Voltage-Max (V)	1.9
Operating Current (mA)	1375
Operating Temperature-Min	-55
Operating Temperature-Max	125
Supplier Temperature Grade	Military
ECC Support	Yes
Number of Chip Banks	8
CAS Latency	6
PLL	No
SPD EEPROM Support	No
Self Refresh	Yes
Original Package	BGA
Pin Count	208
Terminal Form	Surface Mount
Package Height	3.94(Max)
Package Length	22.1(Max)
Package Width	16.1(Max)