MT49H8M36HU-33

SKU: 84388

Manufacturer: Micron Technology

DRAM Chip RLDRAM 288Mbit 8Mx36 1.8V 144-Pin FBGA Tray

2770 parts IN STOCK

Shipped from :

Netherlands

Expected Ships :

Rohs State : Need to verify

Increments of 0 pcs

Products specifications

EU RoHS	Not Compliant
ECCN (US)	EAR99
Part Status	Obsolete
HTS	8542.32.00.02
Automotive	No
PPAP	No
DRAM Type	RLDRAM
Chip Density (bit)	288M
Organization	8Mx36
Number of Internal Banks	8
Number of Words per Bank	1M
Number of Bits/Word (bit)	36
Data Bus Width (bit)	36
Maximum Clock Rate (MHz)	300
Address Bus Width (bit)	22
Interface Type	HSTL
Operating Supply Voltage-Min (V)	1.7
Typical Operating Supply Voltage (V)	1.8
Operating Supply Voltage-Max (V)	1.9
Operating Current (mA)	790
Operating Temperature-Min	0
Operating Temperature-Max	95
Supplier Temperature Grade	Commercial
Number of I/O Lines (bit)	36
Packing Method	Tray
Original Package	FBGA
Pin Count	144
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	0.75
Package Length	18.5
Package Width	11
PCB changed	144

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Products specifications

EU RoHS	Not Compliant
ECCN (US)	EAR99
Part Status	Obsolete
HTS	8542.32.00.02
Automotive	No
PPAP	No
DRAM Type	RLDRAM
Chip Density (bit)	288M
Organization	8Mx36
Number of Internal Banks	8
Number of Words per Bank	1M
Number of Bits/Word (bit)	36
Data Bus Width (bit)	36
Maximum Clock Rate (MHz)	300
Address Bus Width (bit)	22
Interface Type	HSTL
Operating Supply Voltage-Min (V)	1.7
Typical Operating Supply Voltage (V)	1.8
Operating Supply Voltage-Max (V)	1.9
Operating Current (mA)	790
Operating Temperature-Min	0
Operating Temperature-Max	95
Supplier Temperature Grade	Commercial
Number of I/O Lines (bit)	36
Packing Method	Tray
Original Package	FBGA
Pin Count	144
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	0.75
Package Length	18.5
Package Width	11
PCB changed	144