MT46H32M16LFCK-75

SKU: 141072

Manufacturer: Micron Technology

DRAM Chip Mobile-DDR SDRAM 512Mbit 32Mx16 1.8V 60-Pin VFBGA Tray

750 parts IN STOCK

Shipped from :

Netherlands

Expected Ships :

Rohs State : Need to verify

Increments of 0 pcs

Products specifications

EU RoHS	Compliant
ECCN (US)	EAR99
Part Status	Obsolete
HTS	8542.32.00.24
Automotive	No
PPAP	No
DRAM Type	Mobile-DDR SDRAM
Chip Density (bit)	512M
Organization	32Mx16
Number of Internal Banks	4
Number of Words per Bank	8M
Number of Bits/Word (bit)	16
Data Bus Width (bit)	16
Maximum Clock Rate (MHz)	133
Maximum Access Time (ns)	6.5
Address Bus Width (bit)	15
Interface Type	LVCMOS
Operating Supply Voltage-Min (V)	1.7
Typical Operating Supply Voltage (V)	1.8
Operating Supply Voltage-Max (V)	1.95
Operating Current (mA)	90
Operating Temperature-Min	0
Operating Temperature-Max	70
Supplier Temperature Grade	Commercial
Number of I/O Lines (bit)	16
Packing Method	Tray
Original Package	VFBGA
Pin Count	60
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	0.65
Package Length	11.5
Package Width	10
PCB changed	60

Your name

Your email

Enquiry

Products specifications

EU RoHS	Compliant
ECCN (US)	EAR99
Part Status	Obsolete
HTS	8542.32.00.24
Automotive	No
PPAP	No
DRAM Type	Mobile-DDR SDRAM
Chip Density (bit)	512M
Organization	32Mx16
Number of Internal Banks	4
Number of Words per Bank	8M
Number of Bits/Word (bit)	16
Data Bus Width (bit)	16
Maximum Clock Rate (MHz)	133
Maximum Access Time (ns)	6.5
Address Bus Width (bit)	15
Interface Type	LVCMOS
Operating Supply Voltage-Min (V)	1.7
Typical Operating Supply Voltage (V)	1.8
Operating Supply Voltage-Max (V)	1.95
Operating Current (mA)	90
Operating Temperature-Min	0
Operating Temperature-Max	70
Supplier Temperature Grade	Commercial
Number of I/O Lines (bit)	16
Packing Method	Tray
Original Package	VFBGA
Pin Count	60
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	0.65
Package Length	11.5
Package Width	10
PCB changed	60