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MT36HTF51272FZ-667H1D6
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MT4HTF6464HZ-667H1
MT36HTF51272FZ-667H1D6
SKU:
91417
Manufacturer:
Micron Technology
DRAM Module DDR2 SDRAM 4Gbyte 240FBDIMM Tray
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3380 parts IN STOCK
Shipped from :
Netherlands
Expected Ships :
Rohs State :
Need to verify
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Specifications
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Products specifications
EU RoHS
Compliant with Exemption
ECCN (US)
EAR99
Part Status
Obsolete
HTS
8473.30.11.40
Automotive
Unknown
Module
DRAM Module
Subcategory
DDR2 SDRAM
Module Density
4Gbyte
Organization
512Mx72
Module Type
240FBDIMM
Number of Chip per Module
36
Chip Density (bit)
1G
Data Bus Width (bit)
72
Maximum Clock Rate (MHz)
667
Chip Configuration
256Mx4
Operating Supply Voltage-Min (V)
1.7
Typical Operating Supply Voltage (V)
1.8
Operating Supply Voltage-Max (V)
1.9
Operating Temperature-Min
0
Operating Temperature-Max
95
Module Sides
Double
ECC Support
Yes
Number of Ranks
Dual
Number of Chip Banks
8
CAS Latency
5
PC Type
PC2-5300
PLL
No
SPD EEPROM Support
Yes
Self Refresh
No
Refresh Cycles
8K
Packing Method
Tray
Original Package
FBDIMM
Pin Count
240
Standard Package Method
DIM
Terminal Form
Socket
Package Height
30.5(Max)
Package Length
133.5(Max)
Package Width
5.1(Max)
PCB changed
240
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MT36HTF51272FZ-667H1D6
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MT36HTF51272FZ-667H1D6
Datasheet
MT36HTF51272FZ-667H1D6
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MT36HTF51272FZ-667H1D6
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MT36HTF51272FZ-667H1D6
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MT36HTF51272FZ-667H1D6
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MT36HTF51272FZ-667H1D6
In Stock
MT36HTF51272FZ-667H1D6
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MT36HTF51272FZ-667H1D6
Memory Modules
MT36HTF51272FZ-667H1D6
Micron Technology
Products specifications
EU RoHS
Compliant with Exemption
ECCN (US)
EAR99
Part Status
Obsolete
HTS
8473.30.11.40
Automotive
Unknown
Module
DRAM Module
Subcategory
DDR2 SDRAM
Module Density
4Gbyte
Organization
512Mx72
Module Type
240FBDIMM
Number of Chip per Module
36
Chip Density (bit)
1G
Data Bus Width (bit)
72
Maximum Clock Rate (MHz)
667
Chip Configuration
256Mx4
Operating Supply Voltage-Min (V)
1.7
Typical Operating Supply Voltage (V)
1.8
Operating Supply Voltage-Max (V)
1.9
Operating Temperature-Min
0
Operating Temperature-Max
95
Module Sides
Double
ECC Support
Yes
Number of Ranks
Dual
Number of Chip Banks
8
CAS Latency
5
PC Type
PC2-5300
PLL
No
SPD EEPROM Support
Yes
Self Refresh
No
Refresh Cycles
8K
Packing Method
Tray
Original Package
FBDIMM
Pin Count
240
Standard Package Method
DIM
Terminal Form
Socket
Package Height
30.5(Max)
Package Length
133.5(Max)
Package Width
5.1(Max)
PCB changed
240