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    MT29F2G08ABAEAWP-IT

    SKU: 13631
    Manufacturer: Micron Technology
    SLC NAND Flash Parallel 3.3V 2G-bit 256M x 8 48-Pin TSOP-I Tray
    2020 parts IN STOCK
    Shipped from :
    Netherlands
    Expected Ships :
    Rohs State : Need to verify

    QUANTITY

    Increments of 0 pcs
    Products specifications
    EU RoHS Compliant
    ECCN (US) 3A991.b.1.a
    Part Status Active
    Automotive No
    PPAP No
    Cell Type SLC NAND
    Chip Density (bit) 2G
    Architecture Sectored
    Boot Block Yes
    Block Organization Symmetrical
    Address Bus Width (bit) 29
    Sector Size 128Kbyte x 2048
    Page Size 2Kbyte
    Number of Bits/Word (bit) 8
    Number of Words 256M
    Programmability Yes
    Timing Type Asynchronous
    Maximum Erase Time (s) 0.003/Block
    Maximum Programming Time (ms) 0.6/Page
    Process Technology CMOS
    Interface Type Parallel
    Operating Supply Voltage-Min (V) 2.7
    Typical Operating Supply Voltage (V) 3.3
    Operating Supply Voltage-Max (V) 3.6
    Operating Current (mA) 35
    Program Current (mA) 35
    Operating Temperature-Min -40
    Operating Temperature-Max 85
    Supplier Temperature Grade Industrial
    Command Compatible No
    ECC Support Yes
    Support of Page Mode Yes
    Minimum Endurance (Cycles) 100000
    Packing Method Tray
    Original Package TSOP-I
    Pin Count 48
    Standard Package Method SOP
    Terminal Form Surface Mount
    Package Height 1(Max)
    Package Length 12
    Package Width 18.4
    PCB changed 48
    Products specifications
    EU RoHS Compliant
    ECCN (US) 3A991.b.1.a
    Part Status Active
    Automotive No
    PPAP No
    Cell Type SLC NAND
    Chip Density (bit) 2G
    Architecture Sectored
    Boot Block Yes
    Block Organization Symmetrical
    Address Bus Width (bit) 29
    Sector Size 128Kbyte x 2048
    Page Size 2Kbyte
    Number of Bits/Word (bit) 8
    Number of Words 256M
    Programmability Yes
    Timing Type Asynchronous
    Maximum Erase Time (s) 0.003/Block
    Maximum Programming Time (ms) 0.6/Page
    Process Technology CMOS
    Interface Type Parallel
    Operating Supply Voltage-Min (V) 2.7
    Typical Operating Supply Voltage (V) 3.3
    Operating Supply Voltage-Max (V) 3.6
    Operating Current (mA) 35
    Program Current (mA) 35
    Operating Temperature-Min -40
    Operating Temperature-Max 85
    Supplier Temperature Grade Industrial
    Command Compatible No
    ECC Support Yes
    Support of Page Mode Yes
    Minimum Endurance (Cycles) 100000
    Packing Method Tray
    Original Package TSOP-I
    Pin Count 48
    Standard Package Method SOP
    Terminal Form Surface Mount
    Package Height 1(Max)
    Package Length 12
    Package Width 18.4
    PCB changed 48