MT16HTF25664HZ-800H1

SKU: 151140

Manufacturer: Micron Technology

DRAM Module DDR2 SDRAM 2Gbyte 200SODIMM Tray

1190 parts IN STOCK

Shipped from :

Netherlands

Expected Ships :

Rohs State : Need to verify

Increments of 0 pcs

Products specifications

EU RoHS	Compliant with Exemption
ECCN (US)	EAR99
Part Status	Obsolete
HTS	8473.30.11.40
Automotive	No
PPAP	No
Module	DRAM Module
Subcategory	DDR2 SDRAM
Module Density	2Gbyte
Organization	256Mx64
Module Type	200SODIMM
Number of Chip per Module	16
Chip Density (bit)	1G
Data Bus Width (bit)	64
Maximum Clock Rate (MHz)	800
Chip Configuration	128Mx8
Operating Supply Voltage-Min (V)	1.7
Typical Operating Supply Voltage (V)	2.5
Operating Supply Voltage-Max (V)	3.6
Operating Current (mA)	1336
Operating Temperature-Min	0
Operating Temperature-Max	70
Supplier Temperature Grade	Commercial
Module Sides	Double
ECC Support	No
Number of Ranks	Dual
Number of Chip Banks	8
CAS Latency	6
PC Type	PC2-6400
PLL	No
SPD EEPROM Support	Yes
Self Refresh	Yes
Refresh Cycles	8K
Packing Method	Tray
Original Package	SODIMM
Pin Count	200
Standard Package Method	DIM
Terminal Form	Socket
Package Height	30.15(Max)
Package Length	67.75(Max)
Package Width	3.8(Max)
PCB changed	200

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Products specifications

EU RoHS	Compliant with Exemption
ECCN (US)	EAR99
Part Status	Obsolete
HTS	8473.30.11.40
Automotive	No
PPAP	No
Module	DRAM Module
Subcategory	DDR2 SDRAM
Module Density	2Gbyte
Organization	256Mx64
Module Type	200SODIMM
Number of Chip per Module	16
Chip Density (bit)	1G
Data Bus Width (bit)	64
Maximum Clock Rate (MHz)	800
Chip Configuration	128Mx8
Operating Supply Voltage-Min (V)	1.7
Typical Operating Supply Voltage (V)	2.5
Operating Supply Voltage-Max (V)	3.6
Operating Current (mA)	1336
Operating Temperature-Min	0
Operating Temperature-Max	70
Supplier Temperature Grade	Commercial
Module Sides	Double
ECC Support	No
Number of Ranks	Dual
Number of Chip Banks	8
CAS Latency	6
PC Type	PC2-6400
PLL	No
SPD EEPROM Support	Yes
Self Refresh	Yes
Refresh Cycles	8K
Packing Method	Tray
Original Package	SODIMM
Pin Count	200
Standard Package Method	DIM
Terminal Form	Socket
Package Height	30.15(Max)
Package Length	67.75(Max)
Package Width	3.8(Max)
PCB changed	200