EDB4432BBPA-1D-F-D

SKU: 75262

Manufacturer: Micron Technology

DRAM Chip Mobile LPDDR2 SDRAM 4Gbit 128Mx32 1.2V/1.8V 168-Pin FBGA Tray

2870 parts IN STOCK

Shipped from :

Netherlands

Expected Ships :

Rohs State : Need to verify

Increments of 0 pcs

Products specifications

EU RoHS	Compliant
ECCN (US)	EAR99
Part Status	Obsolete
HTS	8542.32.00.36
Automotive	No
PPAP	No
DRAM Type	Mobile LPDDR2 SDRAM
Chip Density (bit)	4G
Organization	128Mx32
Number of Internal Banks	8
Number of Words per Bank	16M
Number of Bits/Word (bit)	32
Data Bus Width (bit)	32
Maximum Clock Rate (MHz)	1066
Address Bus Width (bit)	14
Interface Type	HSUL_12
Operating Supply Voltage-Min (V)	1.14
Typical Operating Supply Voltage (V)	1.2
Operating Supply Voltage-Max (V)	1.3
Operating Current (mA)	260
Operating Temperature-Min	-30
Operating Temperature-Max	85
Number of I/O Lines (bit)	32
Packing Method	Tray
Original Package	FBGA
Pin Count	168
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	0.45
Package Length	12
Package Width	12
PCB changed	168

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Products specifications

EU RoHS	Compliant
ECCN (US)	EAR99
Part Status	Obsolete
HTS	8542.32.00.36
Automotive	No
PPAP	No
DRAM Type	Mobile LPDDR2 SDRAM
Chip Density (bit)	4G
Organization	128Mx32
Number of Internal Banks	8
Number of Words per Bank	16M
Number of Bits/Word (bit)	32
Data Bus Width (bit)	32
Maximum Clock Rate (MHz)	1066
Address Bus Width (bit)	14
Interface Type	HSUL_12
Operating Supply Voltage-Min (V)	1.14
Typical Operating Supply Voltage (V)	1.2
Operating Supply Voltage-Max (V)	1.3
Operating Current (mA)	260
Operating Temperature-Min	-30
Operating Temperature-Max	85
Number of I/O Lines (bit)	32
Packing Method	Tray
Original Package	FBGA
Pin Count	168
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	0.45
Package Length	12
Package Width	12
PCB changed	168