EDB4432BBBJ-1DAIT-F-R

SKU: 122286

Manufacturer: Micron Technology

DRAM Chip Mobile LPDDR2 SDRAM 4Gbit 128Mx32 1.2V/1.8V Automotive 134-Pin FBGA T/R

1860 parts IN STOCK

Shipped from :

Netherlands

Expected Ships :

Rohs State : Need to verify

Increments of 0 pcs

Products specifications

EU RoHS	Compliant
ECCN (US)	EAR99
Part Status	Obsolete
HTS	8542.32.00.36
Automotive	Unknown
PPAP	Unknown
DRAM Type	Mobile LPDDR2 SDRAM
Chip Density (bit)	4G
Organization	128Mx32
Number of Internal Banks	8
Number of Words per Bank	16M
Number of Bits/Word (bit)	32
Data Bus Width (bit)	32
Maximum Clock Rate (MHz)	1066
Address Bus Width (bit)	14
Process Technology	CMOS
Interface Type	HDUL_12
Operating Supply Voltage-Min (V)	1.14
Typical Operating Supply Voltage (V)	1.2
Operating Supply Voltage-Max (V)	1.3
Operating Temperature-Min	-40
Operating Temperature-Max	85
Supplier Temperature Grade	Industrial
Number of I/O Lines (bit)	32
Packing Method	Tape and Reel
Original Package	FBGA
Pin Count	134
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	0.37
Package Length	11.5
Package Width	10
PCB changed	134

Your name

Your email

Enquiry

Products specifications

EU RoHS	Compliant
ECCN (US)	EAR99
Part Status	Obsolete
HTS	8542.32.00.36
Automotive	Unknown
PPAP	Unknown
DRAM Type	Mobile LPDDR2 SDRAM
Chip Density (bit)	4G
Organization	128Mx32
Number of Internal Banks	8
Number of Words per Bank	16M
Number of Bits/Word (bit)	32
Data Bus Width (bit)	32
Maximum Clock Rate (MHz)	1066
Address Bus Width (bit)	14
Process Technology	CMOS
Interface Type	HDUL_12
Operating Supply Voltage-Min (V)	1.14
Typical Operating Supply Voltage (V)	1.2
Operating Supply Voltage-Max (V)	1.3
Operating Temperature-Min	-40
Operating Temperature-Max	85
Supplier Temperature Grade	Industrial
Number of I/O Lines (bit)	32
Packing Method	Tape and Reel
Original Package	FBGA
Pin Count	134
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	0.37
Package Length	11.5
Package Width	10
PCB changed	134