BM77SPPS3MC2-0007AA

SKU: 53668

Manufacturer: Microchip Technology

Bluetooth v4.0 (BLE) + EDR SMART SOC/SMART SOC Class II IoT 3Mbps 33-Pin SMD Module Tray

1890 parts IN STOCK

Shipped from :

Netherlands

Expected Ships :

Rohs State : Need to verify

Increments of 0 pcs

Products specifications

EU RoHS	Compliant
ECCN (US)	5A992.b
Part Status	NRND
HTS	8517.62.00.90
Automotive	No
PPAP	No
Type	Module
Protocols Supported	Bluetooth v4.0 (BLE) + EDR
Processing Unit Type	Microcontroller
Power Class	Class II
Maximum Data Rate (Mbps)	3
Minimum Operating Frequency (MHz)	2402
Maximum Operating Frequency (MHz)	2480
Typical Sensitivity (dBm)	-92
Interface Type	UART
Operating Supply Voltage-Min (V)	3.2
Operating Supply Voltage-Max (V)	4.3
Maximum Standby Current (A)	2.543m(Typ)
Maximum Supply Current (A)	0.07
Antenna Terminal Form	On Board
Operating Temperature-Min	-40
Operating Temperature-Max	85
Supplier Temperature Grade	Industrial
Packing Method	Tray
Special Features	IoT
Original Package	SMD Module
Pin Count	33
Standard Package Method	SMD Module
Terminal Form	Surface Mount
Package Height	2.4
Package Length	22
Package Width	12

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Products specifications

EU RoHS	Compliant
ECCN (US)	5A992.b
Part Status	NRND
HTS	8517.62.00.90
Automotive	No
PPAP	No
Type	Module
Protocols Supported	Bluetooth v4.0 (BLE) + EDR
Processing Unit Type	Microcontroller
Power Class	Class II
Maximum Data Rate (Mbps)	3
Minimum Operating Frequency (MHz)	2402
Maximum Operating Frequency (MHz)	2480
Typical Sensitivity (dBm)	-92
Interface Type	UART
Operating Supply Voltage-Min (V)	3.2
Operating Supply Voltage-Max (V)	4.3
Maximum Standby Current (A)	2.543m(Typ)
Maximum Supply Current (A)	0.07
Antenna Terminal Form	On Board
Operating Temperature-Min	-40
Operating Temperature-Max	85
Supplier Temperature Grade	Industrial
Packing Method	Tray
Special Features	IoT
Original Package	SMD Module
Pin Count	33
Standard Package Method	SMD Module
Terminal Form	Surface Mount
Package Height	2.4
Package Length	22
Package Width	12