|
EU RoHS
|
Not Compliant |
|
ECCN (US)
|
3A991.d. |
|
Part Status
|
Active |
|
HTS
|
8542.39.00.01 |
|
Automotive
|
No |
|
PPAP
|
No |
|
Family Name
|
Fusion® |
|
Process Technology
|
130nm |
|
User I/Os
|
223 |
|
Number of I/O Banks
|
5 |
|
Number of Inter Dielectric Layers
|
7 |
|
Number of Registers
|
38400 |
|
Operating Supply Voltage (V)
|
1.5 |
|
Device System Gates
|
1500000 |
|
Program Memory Type
|
FLASH |
|
Embedded Memory (Kbit)
|
270 |
|
Total Number of Block RAM
|
60 |
|
Device Logic Gates
|
1500000 |
|
Number of Global Clocks
|
18 |
|
Device Number of DLLs/PLLs
|
2 |
|
Programmability
|
Yes |
|
Reprogrammability Support
|
Yes |
|
Copy Protection
|
No |
|
Opr. Frequency (MHz)
|
1098.9 |
|
In-System Programmability
|
Yes |
|
Speed Grade
|
STD |
|
Maximum I/O Performance
|
700Mbps |
|
Operating Supply Voltage-Min (V)
|
1.425 |
|
Operating Supply Voltage-Max (V)
|
1.575 |
|
Operating Temperature-Min
|
0 |
|
Operating Temperature-Max
|
70 |
|
Supplier Temperature Grade
|
Commercial |
|
Packing Method
|
Tray |
|
Tradename
|
Fusion® |
|
Original Package
|
FBGA |
|
Pin Count
|
484 |
|
Standard Package Method
|
BGA |
|
Terminal Form
|
Surface Mount |
|
Package Height
|
1.73 |
|
Package Length
|
23 |
|
Package Width
|
23 |
|
PCB changed
|
484 |