EU RoHS
|
Compliant |
ECCN (US)
|
3A001.a.7.b |
Part Status
|
Active |
HTS
|
8542.39.00.01 |
Automotive
|
Yes |
PPAP
|
Yes |
Family Name
|
ProASIC®3 |
Process Technology
|
130nm |
User I/Os
|
97 |
Number of I/O Banks
|
4 |
Number of Inter Dielectric Layers
|
7 |
Number of Registers
|
6144 |
Operating Supply Voltage (V)
|
1.5 |
Device System Gates
|
250000 |
Program Memory Type
|
FLASH |
Embedded Memory (Kbit)
|
36 |
Total Number of Block RAM
|
8 |
Device Logic Gates
|
250000 |
Number of Global Clocks
|
18 |
Device Number of DLLs/PLLs
|
1 |
JTAG Support
|
Yes |
Programmability
|
Yes |
Reprogrammability Support
|
Yes |
Copy Protection
|
No |
Opr. Frequency (MHz)
|
231 |
In-System Programmability
|
Yes |
Speed Grade
|
STD |
Differential I/O Standards
|
LVDS |
Single-Ended I/O Standards
|
LVTTL |
Maximum Differential I/O Pairs
|
24 |
Maximum I/O Performance
|
700Mbps |
Operating Supply Voltage-Min (V)
|
1.425 |
Operating Supply Voltage-Max (V)
|
1.575 |
I/O Voltage (V)
|
1.5 |
Packing Method
|
Tray |
Tradename
|
ProASIC |
Original Package
|
FBGA |
Pin Count
|
144 |
Standard Package Method
|
BGA |
Terminal Form
|
Surface Mount |
Package Height
|
1.05 |
Package Length
|
13 |
Package Width
|
13 |
PCB changed
|
144 |