2N3501UB

SKU: 93323

Manufacturer: Microchip Technology

Trans GP BJT NPN 150V 0.3A 500mW 3-Pin SMD Waffle

2500 parts IN STOCK

Shipped from :

Netherlands

Expected Ships :

Rohs State : Need to verify

Increments of 0 pcs

Products specifications

EU RoHS	Not Compliant
ECCN (US)	EAR99
Part Status	Active
HTS	8541.21.00.95
Automotive	No
PPAP	No
Type	NPN
Product Category	Bipolar Power
Body Material	Si
Configuration	Single
Number of Elements per pcs	1
Collector Base Voltage-Max (V)	150
Collector-Emitter Voltage-Max (V)	150
Maximum Emitter Base Voltage (V)	6
Maximum Base Emitter Saturation Voltage (V)	0.8@1mA@10mA
Maximum Collector-Emitter Saturation Voltage (V)	0.2@1mA@10mA
Maximum DC Collector Current (A)	0.3
Minimum DC Current Gain	35@0.1mA@10V
Maximum Power Dissipation (mW)	500
Operating Temperature-Min	-65
Operating Temperature-Max	200
Packing Method	Waffle
Supplier Temperature Grade	Commercial
Original Package	SMD
Pin Count	3
Standard Package Method	SMD
Terminal Form	Surface Mount

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Products specifications

EU RoHS	Not Compliant
ECCN (US)	EAR99
Part Status	Active
HTS	8541.21.00.95
Automotive	No
PPAP	No
Type	NPN
Product Category	Bipolar Power
Body Material	Si
Configuration	Single
Number of Elements per pcs	1
Collector Base Voltage-Max (V)	150
Collector-Emitter Voltage-Max (V)	150
Maximum Emitter Base Voltage (V)	6
Maximum Base Emitter Saturation Voltage (V)	0.8@1mA@10mA
Maximum Collector-Emitter Saturation Voltage (V)	0.2@1mA@10mA
Maximum DC Collector Current (A)	0.3
Minimum DC Current Gain	35@0.1mA@10V
Maximum Power Dissipation (mW)	500
Operating Temperature-Min	-65
Operating Temperature-Max	200
Packing Method	Waffle
Supplier Temperature Grade	Commercial
Original Package	SMD
Pin Count	3
Standard Package Method	SMD
Terminal Form	Surface Mount