MX30UF4G18AB-XKI

SKU: 112680

Manufacturer: Macronix International

SLC NAND Flash Parallel 1.8V 4G-bit 512M x 8 63-Pin VFBGA

1290 parts IN STOCK

Shipped from :

Netherlands

Expected Ships :

Rohs State : Need to verify

Increments of 0 pcs

Products specifications

EU RoHS	Compliant
ECCN (US)	3A991b.1.a.
Part Status	NRND
HTS	8542.32.00.71
Automotive	No
PPAP	No
Cell Type	SLC NAND
Chip Density (bit)	4G
Architecture	Non Sectored
Boot Block	No
Address Bus Width (bit)	30
Page Size	2Kbyte
Number of Bits/Word (bit)	8
Number of Words	512M
Programmability	Yes
Timing Type	Asynchronous
Maximum Erase Time (s)	0.0035/Block
Maximum Programming Time (ms)	0.6/Page
Interface Type	Parallel
Operating Supply Voltage-Min (V)	1.7
Typical Operating Supply Voltage (V)	1.8
Operating Supply Voltage-Max (V)	1.95
Operating Current (mA)	30
Program Current (mA)	30
Operating Temperature-Min	-40
Operating Temperature-Max	85
Supplier Temperature Grade	Industrial
Command Compatible	Yes
ECC Support	Yes
Support of Page Mode	Yes
Minimum Endurance (Cycles)	100000(Typ)
Original Package	VFBGA
Pin Count	63
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	0.55(Min)
Package Length	11
Package Width	9
PCB changed	63

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Products specifications

EU RoHS	Compliant
ECCN (US)	3A991b.1.a.
Part Status	NRND
HTS	8542.32.00.71
Automotive	No
PPAP	No
Cell Type	SLC NAND
Chip Density (bit)	4G
Architecture	Non Sectored
Boot Block	No
Address Bus Width (bit)	30
Page Size	2Kbyte
Number of Bits/Word (bit)	8
Number of Words	512M
Programmability	Yes
Timing Type	Asynchronous
Maximum Erase Time (s)	0.0035/Block
Maximum Programming Time (ms)	0.6/Page
Interface Type	Parallel
Operating Supply Voltage-Min (V)	1.7
Typical Operating Supply Voltage (V)	1.8
Operating Supply Voltage-Max (V)	1.95
Operating Current (mA)	30
Program Current (mA)	30
Operating Temperature-Min	-40
Operating Temperature-Max	85
Supplier Temperature Grade	Industrial
Command Compatible	Yes
ECC Support	Yes
Support of Page Mode	Yes
Minimum Endurance (Cycles)	100000(Typ)
Original Package	VFBGA
Pin Count	63
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	0.55(Min)
Package Length	11
Package Width	9
PCB changed	63