LTV-817M-C

SKU: 62725

Manufacturer: Lite-On Technology

Optocoupler DC-IN 1-CH Transistor DC-OUT 4-Pin DIP

10 parts IN STOCK

Shipped from :

Netherlands

Expected Ships :

Rohs State : Need to verify

Increments of 0 pcs

Products specifications

EU RoHS	Compliant with Exemption
ECCN (US)	EAR99
Part Status	Unconfirmed
HTS	8541.40.80.00
Automotive	No
PPAP	No
Output Type	DC
Input Type	DC
Output Device	Transistor
Number of Channels per Chip	1
Minimum Isolation Voltage (Vrms)	5000
Operating Temperature-Min	-30
Operating Temperature-Max	110
Maximum Forward Voltage (V)	1.4
Collector-Emitter Voltage-Max (V)	35
Maximum Current Transfer Ratio (%)	400
Standard	BSI
Maximum Collector Current (mA)	50
Maximum Collector-Emitter Saturation Voltage (mV)	200
Maximum Power Dissipation (mW)	200
Maximum Reverse Voltage (V)	6
Typical Forward Voltage (V)	1.2
Maximum Rise Time (us)	18
Maximum Fall Time (us)	18
Maximum Forward Current (mA)	50
Minimum Current Transfer Ratio (%)	200
Current Transfer Ratio Test Current (mA)	5
Typical Rise Time (us)	4
Typical Fall Time (us)	3
Standard Package Method	DIP
Pin Count	4
Original Package	DIP
Terminal Form	Through Hole
Package Height	3.5
Package Length	4.6
Package Width	6.5
PCB changed	4

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Products specifications

EU RoHS	Compliant with Exemption
ECCN (US)	EAR99
Part Status	Unconfirmed
HTS	8541.40.80.00
Automotive	No
PPAP	No
Output Type	DC
Input Type	DC
Output Device	Transistor
Number of Channels per Chip	1
Minimum Isolation Voltage (Vrms)	5000
Operating Temperature-Min	-30
Operating Temperature-Max	110
Maximum Forward Voltage (V)	1.4
Collector-Emitter Voltage-Max (V)	35
Maximum Current Transfer Ratio (%)	400
Standard	BSI
Maximum Collector Current (mA)	50
Maximum Collector-Emitter Saturation Voltage (mV)	200
Maximum Power Dissipation (mW)	200
Maximum Reverse Voltage (V)	6
Typical Forward Voltage (V)	1.2
Maximum Rise Time (us)	18
Maximum Fall Time (us)	18
Maximum Forward Current (mA)	50
Minimum Current Transfer Ratio (%)	200
Current Transfer Ratio Test Current (mA)	5
Typical Rise Time (us)	4
Typical Fall Time (us)	3
Standard Package Method	DIP
Pin Count	4
Original Package	DIP
Terminal Form	Through Hole
Package Height	3.5
Package Length	4.6
Package Width	6.5
PCB changed	4