0 items
You have no items in your shopping cart.
All Categories
    Close
    Filters
    Preferences
    Search

    LFXP6-C-3F256I

    SKU: 132542
    Manufacturer: Lattice Semiconductor
    FPGA LatticeXP Family 6000 Cells 320MHz 130nm Technology 1.8V/2.5V/3.3V 256-Pin FBGA Tray
    1950 parts IN STOCK
    Shipped from :
    Netherlands
    Expected Ships :
    Rohs State : Need to verify

    QUANTITY

    Increments of 0 pcs
    Products specifications
    EU RoHS Not Compliant
    ECCN (US) 3A001.a.7.a
    Part Status Obsolete
    HTS 8542.31.00.01
    Automotive No
    PPAP No
    Family Name LatticeXP
    Process Technology 130nm
    User I/Os 188
    Number of I/O Banks 8
    Number of Inter Dielectric Layers 8
    Operating Supply Voltage (V) 2.5
    Logic Elements 6000
    Program Memory Type SRAM
    Embedded Memory (Kbit) 72
    Total Number of Block RAM 8
    Maximum Distributed RAM Bits 23552
    Device Logic Units 6000
    Number of Global Clocks 4
    Device Number of DLLs/PLLs 2
    Programmability Yes
    Reprogrammability Support Yes
    Copy Protection No
    Opr. Frequency (MHz) 320
    In-System Programmability Yes
    Speed Grade 3
    Maximum Differential I/O Pairs 80
    Operating Supply Voltage-Min (V) 1.71
    Operating Supply Voltage-Max (V) 3.465
    I/O Voltage (V) 3.3
    Operating Temperature-Min -40
    Operating Temperature-Max 100
    Supplier Temperature Grade Industrial
    Packing Method Tray
    Tradename LatticeXP
    Original Package FBGA
    Pin Count 256
    Standard Package Method BGA
    Terminal Form Surface Mount
    Package Height 1.2
    Package Length 17
    Package Width 17
    PCB changed 256
    Products specifications
    EU RoHS Not Compliant
    ECCN (US) 3A001.a.7.a
    Part Status Obsolete
    HTS 8542.31.00.01
    Automotive No
    PPAP No
    Family Name LatticeXP
    Process Technology 130nm
    User I/Os 188
    Number of I/O Banks 8
    Number of Inter Dielectric Layers 8
    Operating Supply Voltage (V) 2.5
    Logic Elements 6000
    Program Memory Type SRAM
    Embedded Memory (Kbit) 72
    Total Number of Block RAM 8
    Maximum Distributed RAM Bits 23552
    Device Logic Units 6000
    Number of Global Clocks 4
    Device Number of DLLs/PLLs 2
    Programmability Yes
    Reprogrammability Support Yes
    Copy Protection No
    Opr. Frequency (MHz) 320
    In-System Programmability Yes
    Speed Grade 3
    Maximum Differential I/O Pairs 80
    Operating Supply Voltage-Min (V) 1.71
    Operating Supply Voltage-Max (V) 3.465
    I/O Voltage (V) 3.3
    Operating Temperature-Min -40
    Operating Temperature-Max 100
    Supplier Temperature Grade Industrial
    Packing Method Tray
    Tradename LatticeXP
    Original Package FBGA
    Pin Count 256
    Standard Package Method BGA
    Terminal Form Surface Mount
    Package Height 1.2
    Package Length 17
    Package Width 17
    PCB changed 256