EU RoHS
|
Compliant |
ECCN (US)
|
3A991d.1. |
Part Status
|
Obsolete |
Automotive
|
No |
PPAP
|
No |
Family Name
|
LatticeXP |
Process Technology
|
130nm |
User I/Os
|
300 |
Number of I/O Banks
|
8 |
Number of Inter Dielectric Layers
|
8 |
Operating Supply Voltage (V)
|
2.5 |
Logic Elements
|
15000 |
Program Memory Type
|
SRAM |
Embedded Memory (Kbit)
|
324 |
Total Number of Block RAM
|
36 |
Maximum Distributed RAM Bits
|
62464 |
Device Logic Units
|
15000 |
Number of Global Clocks
|
4 |
Device Number of DLLs/PLLs
|
4 |
Programmability
|
Yes |
Reprogrammability Support
|
Yes |
Opr. Frequency (MHz)
|
320 |
In-System Programmability
|
Yes |
Speed Grade
|
3 |
Maximum Differential I/O Pairs
|
128 |
Operating Supply Voltage-Min (V)
|
1.71 |
Operating Supply Voltage-Max (V)
|
3.465 |
I/O Voltage (V)
|
1.2 |
Operating Temperature-Min
|
0 |
Operating Temperature-Max
|
85 |
Supplier Temperature Grade
|
Commercial |
Packing Method
|
Tray |
Tradename
|
LatticeXP |
Original Package
|
FBGA |
Pin Count
|
484 |
Standard Package Method
|
BGA |
Terminal Form
|
Surface Mount |
Package Height
|
1.65 |
Package Length
|
23 |
Package Width
|
23 |
PCB changed
|
484 |