EU RoHS
|
Compliant |
ECCN (US)
|
3A991.d |
Part Status
|
Active |
HTS
|
8542.31.00.01 |
Automotive
|
No |
PPAP
|
No |
Family Name
|
LatticeECP2 |
Process Technology
|
90nm |
User I/Os
|
331 |
Number of I/O Banks
|
8 |
Operating Supply Voltage (V)
|
1.2 |
Shift Registers
|
Utilize LUT |
Logic Elements
|
21000 |
Number of Multipliers
|
28 (18x18) |
Program Memory Type
|
SRAM |
Embedded Memory (Kbit)
|
276 |
Total Number of Block RAM
|
15 |
Maximum Distributed RAM Bits
|
43008 |
Device Logic Units
|
21000 |
Device Number of DLLs/PLLs
|
2+0+2 |
Dedicated DSP
|
7 |
Programmability
|
No |
Reprogrammability Support
|
No |
Copy Protection
|
No |
In-System Programmability
|
Yes |
Speed Grade
|
5 |
GMACs
|
9.1 |
Mega Multiply Accumulates per second
|
9100 |
Maximum Differential I/O Pairs
|
165 |
Maximum I/O Performance
|
3.125Gbps |
Operating Supply Voltage-Min (V)
|
1.14 |
Operating Supply Voltage-Max (V)
|
1.26 |
I/O Voltage (V)
|
1.2 |
Operating Temperature-Min
|
0 |
Operating Temperature-Max
|
85 |
Supplier Temperature Grade
|
Commercial |
Packing Method
|
Tray |
Tradename
|
LatticeEC |
Original Package
|
FBGA |
Pin Count
|
484 |
Standard Package Method
|
BGA |
Terminal Form
|
Surface Mount |
Package Height
|
1.65 |
Package Length
|
23 |
Package Width
|
23 |
PCB changed
|
484 |