|
EU RoHS
|
Compliant |
|
ECCN (US)
|
EAR99 |
|
Part Status
|
Active |
|
Automotive
|
Yes |
|
PPAP
|
Unknown |
|
Family Name
|
LatticeECP3 |
|
Process Technology
|
65nm |
|
User I/Os
|
133 |
|
Number of I/O Banks
|
7 |
|
Operating Supply Voltage (V)
|
1.2 |
|
Shift Registers
|
Utilize LUT |
|
Logic Elements
|
17000 |
|
Number of Multipliers
|
24 (18x18) |
|
Program Memory Type
|
SRAM |
|
Embedded Memory (Kbit)
|
700 |
|
Total Number of Block RAM
|
38 |
|
Maximum Distributed RAM Bits
|
36864 |
|
SERDES Channels
|
4 |
|
Device Logic Units
|
17000 |
|
Device Number of DLLs/PLLs
|
2+2 |
|
Dedicated DSP
|
12 |
|
Programmability
|
Yes |
|
Reprogrammability Support
|
No |
|
Copy Protection
|
No |
|
In-System Programmability
|
No |
|
Speed Grade
|
6 |
|
Maximum I/O Performance
|
3.2Gbps |
|
Operating Supply Voltage-Min (V)
|
1.14 |
|
Operating Supply Voltage-Max (V)
|
1.26 |
|
I/O Voltage (V)
|
2.5 |
|
Operating Temperature-Min
|
-40 |
|
Operating Temperature-Max
|
125 |
|
Supplier Temperature Grade
|
Automotive |
|
Packing Method
|
Tray |
|
Tradename
|
LatticeEC |
|
Original Package
|
FTBGA |
|
Pin Count
|
256 |
|
Standard Package Method
|
BGA |
|
Terminal Form
|
Surface Mount |
|
Package Height
|
1.25(Max) |
|
Package Length
|
17 |
|
Package Width
|
17 |
|
PCB changed
|
256 |