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    TLP521-2GBSM/TR

    SKU: 130193
    Manufacturer: Isocom Components
    DC-IN 2-CH Transistor DC-OUT 8-Pin PDIP SMD T/R
    1150 parts IN STOCK
    Shipped from :
    Netherlands
    Expected Ships :
    Rohs State : Need to verify

    QUANTITY

    Increments of 0 pcs
    Products specifications
    EU RoHS Compliant
    ECCN (US) EAR99
    Part Status Active
    Automotive No
    PPAP No
    Output Type DC
    Input Type DC
    Output Device Transistor
    Number of Channels per Chip 2
    Minimum Isolation Voltage (Vrms) 5300
    Operating Temperature-Min -30
    Operating Temperature-Max 100
    Maximum Forward Voltage (V) 1.3
    Collector-Emitter Voltage-Max (V) 55
    Maximum Current Transfer Ratio (%) 600
    Standard VDE
    Maximum Collector-Emitter Saturation Voltage (mV) 400
    Maximum Power Dissipation (mW) 200
    Minimum Forward Voltage (V) 1
    Maximum Reverse Voltage (V) 6
    Typical Forward Voltage (V) 1.15
    Maximum Forward Current (mA) 50
    Packing Method Tape and Reel
    Minimum Current Transfer Ratio (%) 100
    Current Transfer Ratio Test Current (mA) 5
    Typical Rise Time (us) 4
    Typical Fall Time (us) 3
    Standard Package Method DIP
    Pin Count 8
    Original Package PDIP SMD
    Terminal Form Surface Mount
    Package Height 4(Max)
    Package Length 10.16(Max)
    Package Width 7(Max)
    PCB changed 8
    Products specifications
    EU RoHS Compliant
    ECCN (US) EAR99
    Part Status Active
    Automotive No
    PPAP No
    Output Type DC
    Input Type DC
    Output Device Transistor
    Number of Channels per Chip 2
    Minimum Isolation Voltage (Vrms) 5300
    Operating Temperature-Min -30
    Operating Temperature-Max 100
    Maximum Forward Voltage (V) 1.3
    Collector-Emitter Voltage-Max (V) 55
    Maximum Current Transfer Ratio (%) 600
    Standard VDE
    Maximum Collector-Emitter Saturation Voltage (mV) 400
    Maximum Power Dissipation (mW) 200
    Minimum Forward Voltage (V) 1
    Maximum Reverse Voltage (V) 6
    Typical Forward Voltage (V) 1.15
    Maximum Forward Current (mA) 50
    Packing Method Tape and Reel
    Minimum Current Transfer Ratio (%) 100
    Current Transfer Ratio Test Current (mA) 5
    Typical Rise Time (us) 4
    Typical Fall Time (us) 3
    Standard Package Method DIP
    Pin Count 8
    Original Package PDIP SMD
    Terminal Form Surface Mount
    Package Height 4(Max)
    Package Length 10.16(Max)
    Package Width 7(Max)
    PCB changed 8