IRF6216TRPBF

SKU: 82651

Manufacturer: International Rectifier

Trans MOSFET P-CH 150V 2.2A 8-Pin SOIC T/R

29610 parts IN STOCK

Shipped from :

Netherlands

Expected Ships :

Rohs State : Need to verify

Increments of 0 pcs

Products specifications

EU RoHS	Compliant
ECCN (US)	EAR99
Part Status	Obsolete
HTS	8541.21.00.75
Automotive	No
PPAP	No
Product Category	Power MOSFET
Configuration	Single Quad Drain Triple Source
Process Technology	HEXFET
Channel Mode	Enhancement
Channel Type	P
Number of Elements per pcs	1
Maximum Drain Source Voltage (V)	150
Maximum Gate Source Voltage (V)	±20
Maximum Continuous Drain Current (A)	2.2
Maximum Drain Source Resistance (mOhm)	240@10V
Typical Gate Charge @ Vgs (nC)	33@10V
Typical Gate Charge @ 10V (nC)	33
Typical Input Capacitance @ Vds (pF)	1280@25V
Maximum Power Dissipation (mW)	2500
Typical Fall Time (ns)	26
Typical Rise Time (ns)	15
Typical Turn-Off Delay Time (ns)	33
Typical Turn-On Delay Time (ns)	18
Operating Temperature-Min	-55
Operating Temperature-Max	150
Packing Method	Tape and Reel
Pin Count	8
Standard Package Method	SOP
Original Package	SOIC
Terminal Form	Surface Mount
Package Height	1.5(Max)
Package Length	5(Max)
Package Width	4(Max)
PCB changed	8

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Products specifications

EU RoHS	Compliant
ECCN (US)	EAR99
Part Status	Obsolete
HTS	8541.21.00.75
Automotive	No
PPAP	No
Product Category	Power MOSFET
Configuration	Single Quad Drain Triple Source
Process Technology	HEXFET
Channel Mode	Enhancement
Channel Type	P
Number of Elements per pcs	1
Maximum Drain Source Voltage (V)	150
Maximum Gate Source Voltage (V)	±20
Maximum Continuous Drain Current (A)	2.2
Maximum Drain Source Resistance (mOhm)	240@10V
Typical Gate Charge @ Vgs (nC)	33@10V
Typical Gate Charge @ 10V (nC)	33
Typical Input Capacitance @ Vds (pF)	1280@25V
Maximum Power Dissipation (mW)	2500
Typical Fall Time (ns)	26
Typical Rise Time (ns)	15
Typical Turn-Off Delay Time (ns)	33
Typical Turn-On Delay Time (ns)	18
Operating Temperature-Min	-55
Operating Temperature-Max	150
Packing Method	Tape and Reel
Pin Count	8
Standard Package Method	SOP
Original Package	SOIC
Terminal Form	Surface Mount
Package Height	1.5(Max)
Package Length	5(Max)
Package Width	4(Max)
PCB changed	8