EU RoHS
|
Compliant |
ECCN (US)
|
EAR99 |
Part Status
|
NRND |
HTS
|
8542.39.00.01 |
Automotive
|
No |
PPAP
|
No |
Family Name
|
MAX® II |
Logic Elements
|
570 |
Program Memory Type
|
FLASH |
Memory Size (Kbit)
|
8 |
Number of Logic Blocks/Elements
|
57 |
Number of Global Clocks
|
4 |
Number of I/O Banks
|
2 |
Number of Macro Cells
|
440 |
Process Technology
|
0.18um |
Data Gate
|
No |
Maximum Number of User I/Os
|
160 |
In-System Programmability
|
Yes |
Number of Inter Dielectric Layers
|
6 |
Programmability
|
Yes |
Reprogrammability Support
|
No |
Programmable Type
|
In System Programmable |
Maximum Internal Frequency (MHz)
|
1879.7 |
Maximum Clock to Output Delay (ns)
|
7.1 |
Maximum Propagation Delay Time (ns)
|
8.7 |
Speed Grade
|
5 |
Individual Output Enable Control
|
Yes |
Operating Supply Voltage-Min (V)
|
2.375 |
Operating Supply Voltage-Max (V)
|
3.6 |
Typical Operating Supply Voltage (V)
|
3.3 |
I/O Voltage (V)
|
3.3 |
Tolerant Configuration Interface Voltage (V)
|
1.8 |
Operating Temperature-Min
|
0 |
Operating Temperature-Max
|
85 |
Supplier Temperature Grade
|
Commercial |
Packing Method
|
Tray |
Tradename
|
MAX |
Original Package
|
FBGA |
Pin Count
|
256 |
Standard Package Method
|
BGA |
Terminal Form
|
Surface Mount |
Package Height
|
1.25 |
Package Length
|
17 |
Package Width
|
17 |
PCB changed
|
256 |