IS61NLP102418-200B3LI

SKU: 40361

Manufacturer: Integrated Silicon Solution Inc

SRAM Chip Sync Dual 3.3V 18M-bit 1M x 18 3.1ns 165-Pin BGA

270 parts IN STOCK

Shipped from :

Netherlands

Expected Ships :

Rohs State : Need to verify

Increments of 0 pcs

Products specifications

EU RoHS	Compliant
ECCN (US)	3A991.b.2.a
Part Status	Active
HTS	8542.32.00.41
Automotive	No
PPAP	No
Chip Density (bit)	18M
Number of Words	1M
Number of Bits/Word (bit)	18
Architecture	Pipelined
Data Rate Architecture	SDR
Address Bus Width (bit)	20
Number of Ports	2
Timing Type	Synchronous
Max. Access Time (ns)	3.1
Maximum Clock Rate (MHz)	200
Process Technology	CMOS
Operating Supply Voltage-Min (V)	3.135
Typical Operating Supply Voltage (V)	3.3
Operating Supply Voltage-Max (V)	3.465
Operating Current (mA)	475
Operating Temperature-Min	-40
Operating Temperature-Max	85
Supplier Temperature Grade	Industrial
Original Package	BGA
Pin Count	165
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	0.79
Package Length	15
Package Width	13
PCB changed	165

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Products specifications

EU RoHS	Compliant
ECCN (US)	3A991.b.2.a
Part Status	Active
HTS	8542.32.00.41
Automotive	No
PPAP	No
Chip Density (bit)	18M
Number of Words	1M
Number of Bits/Word (bit)	18
Architecture	Pipelined
Data Rate Architecture	SDR
Address Bus Width (bit)	20
Number of Ports	2
Timing Type	Synchronous
Max. Access Time (ns)	3.1
Maximum Clock Rate (MHz)	200
Process Technology	CMOS
Operating Supply Voltage-Min (V)	3.135
Typical Operating Supply Voltage (V)	3.3
Operating Supply Voltage-Max (V)	3.465
Operating Current (mA)	475
Operating Temperature-Min	-40
Operating Temperature-Max	85
Supplier Temperature Grade	Industrial
Original Package	BGA
Pin Count	165
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	0.79
Package Length	15
Package Width	13
PCB changed	165