EU RoHS
|
Compliant |
ECCN (US)
|
EAR99 |
Part Status
|
NRND |
HTS
|
8542.32.00.32 |
Automotive
|
No |
PPAP
|
No |
DRAM Type
|
DDR RLDRAM3 |
Chip Density (bit)
|
576M |
Organization
|
16Mx36 |
Number of Internal Banks
|
16 |
Number of Words per Bank
|
1M |
Number of Bits/Word (bit)
|
36 |
Data Bus Width (bit)
|
36 |
Maximum Clock Rate (MHz)
|
933 |
Maximum Access Time (ns)
|
10 |
Address Bus Width (bit)
|
23 |
Process Technology
|
CMOS |
Operating Supply Voltage-Min (V)
|
1.28 |
Typical Operating Supply Voltage (V)
|
1.35 |
Operating Supply Voltage-Max (V)
|
1.42 |
Operating Current (mA)
|
1685 |
Operating Temperature-Min
|
0 |
Operating Temperature-Max
|
95 |
Supplier Temperature Grade
|
Commercial |
Number of I/O Lines (bit)
|
36 |
Original Package
|
FBGA |
Pin Count
|
168 |
Standard Package Method
|
BGA |
Terminal Form
|
Surface Mount |
Package Height
|
0.68(Min) |
Package Length
|
13.5 |
Package Width
|
13.5 |
PCB changed
|
168 |