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    IS46R16160D-6BLA1-TR

    SKU: 33238
    DRAM Chip DDR SDRAM 256Mbit 16Mx16 2.5V Automotive 60-Pin TFBGA T/R
    3110 parts IN STOCK
    Shipped from :
    Netherlands
    Expected Ships :
    Rohs State : Need to verify

    QUANTITY

    Increments of 0 pcs
    Products specifications
    EU RoHS Compliant
    ECCN (US) EAR99
    Part Status NRND
    HTS 8542.32.00.24
    Automotive Yes
    PPAP Yes
    DRAM Type DDR SDRAM
    Chip Density (bit) 256M
    Organization 16Mx16
    Number of Internal Banks 4
    Number of Words per Bank 4M
    Number of Bits/Word (bit) 16
    Data Bus Width (bit) 16
    Maximum Clock Rate (MHz) 166
    Maximum Access Time (ns) 0.7
    Address Bus Width (bit) 15
    Process Technology CMOS
    Interface Type SSTL_2
    Operating Supply Voltage-Min (V) 2.3
    Typical Operating Supply Voltage (V) 2.5
    Operating Supply Voltage-Max (V) 2.7
    Operating Current (mA) 280
    Operating Temperature-Min -40
    Operating Temperature-Max 85
    Supplier Temperature Grade Automotive
    Number of I/O Lines (bit) 16
    Packing Method Tape and Reel
    Original Package TFBGA
    Pin Count 60
    Standard Package Method BGA
    Terminal Form Surface Mount
    Package Height 0.8(Max)
    Package Length 13
    Package Width 8
    PCB changed 60
    Products specifications
    EU RoHS Compliant
    ECCN (US) EAR99
    Part Status NRND
    HTS 8542.32.00.24
    Automotive Yes
    PPAP Yes
    DRAM Type DDR SDRAM
    Chip Density (bit) 256M
    Organization 16Mx16
    Number of Internal Banks 4
    Number of Words per Bank 4M
    Number of Bits/Word (bit) 16
    Data Bus Width (bit) 16
    Maximum Clock Rate (MHz) 166
    Maximum Access Time (ns) 0.7
    Address Bus Width (bit) 15
    Process Technology CMOS
    Interface Type SSTL_2
    Operating Supply Voltage-Min (V) 2.3
    Typical Operating Supply Voltage (V) 2.5
    Operating Supply Voltage-Max (V) 2.7
    Operating Current (mA) 280
    Operating Temperature-Min -40
    Operating Temperature-Max 85
    Supplier Temperature Grade Automotive
    Number of I/O Lines (bit) 16
    Packing Method Tape and Reel
    Original Package TFBGA
    Pin Count 60
    Standard Package Method BGA
    Terminal Form Surface Mount
    Package Height 0.8(Max)
    Package Length 13
    Package Width 8
    PCB changed 60